A New, Computationally Efficient 'Blech Criterion' for Immortality in General Interconnects

Mohammad Abdullah Al Shohel, Vidya A. Chhabria, Sachin S. Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Traditional methodologies for analyzing electromigration (EM) in VLSI circuits first filter immortal wires using Blech's criterion, and then perform detailed EM analysis on the remaining wires. However, Blech's criterion was designed for two-terminal wires and does not extend to general structures. This paper demonstrates a first-principles-based solution technique for determining the steady-state stress at all the nodes of a general interconnect structure, and develops an immortality test whose complexity is linear in the number of edges of an interconnect structure. The proposed model is applied to a variety of structures. The method is shown to match well with results from numerical solvers, to be scalable to large structures.

Original languageEnglish (US)
Title of host publication2021 58th ACM/IEEE Design Automation Conference, DAC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages913-918
Number of pages6
ISBN (Electronic)9781665432740
DOIs
StatePublished - Dec 5 2021
Event58th ACM/IEEE Design Automation Conference, DAC 2021 - San Francisco, United States
Duration: Dec 5 2021Dec 9 2021

Publication series

NameProceedings - Design Automation Conference
Volume2021-December
ISSN (Print)0738-100X

Conference

Conference58th ACM/IEEE Design Automation Conference, DAC 2021
Country/TerritoryUnited States
CitySan Francisco
Period12/5/2112/9/21

Bibliographical note

Funding Information:
This work was supported in part by the NSF under award CCF-1714805, by the DARPA OpenROAD project, and the Louise Dosdall Fellowship.

Publisher Copyright:
© 2021 IEEE.

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