A New, Computationally Efficient 'Blech Criterion' for Immortality in General Interconnects

Mohammad Abdullah Al Shohel; Vidya A. Chhabria; Sachin S. Sapatnekar

doi:10.1109/DAC18074.2021.9586127

A New, Computationally Efficient 'Blech Criterion' for Immortality in General Interconnects

Mohammad Abdullah Al Shohel, Vidya A. Chhabria, Sachin S. Sapatnekar

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Traditional methodologies for analyzing electromigration (EM) in VLSI circuits first filter immortal wires using Blech's criterion, and then perform detailed EM analysis on the remaining wires. However, Blech's criterion was designed for two-terminal wires and does not extend to general structures. This paper demonstrates a first-principles-based solution technique for determining the steady-state stress at all the nodes of a general interconnect structure, and develops an immortality test whose complexity is linear in the number of edges of an interconnect structure. The proposed model is applied to a variety of structures. The method is shown to match well with results from numerical solvers, to be scalable to large structures.

Original language	English (US)
Title of host publication	2021 58th ACM/IEEE Design Automation Conference, DAC 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	913-918
Number of pages	6
ISBN (Electronic)	9781665432740
DOIs	https://doi.org/10.1109/DAC18074.2021.9586127
State	Published - Dec 5 2021
Event	58th ACM/IEEE Design Automation Conference, DAC 2021 - San Francisco, United States Duration: Dec 5 2021 → Dec 9 2021

Publication series

Name	Proceedings - Design Automation Conference
Volume	2021-December
ISSN (Print)	0738-100X

Conference

Conference	58th ACM/IEEE Design Automation Conference, DAC 2021
Country/Territory	United States
City	San Francisco
Period	12/5/21 → 12/9/21

Bibliographical note

Funding Information:
This work was supported in part by the NSF under award CCF-1714805, by the DARPA OpenROAD project, and the Louise Dosdall Fellowship.

Publisher Copyright:
© 2021 IEEE.

Publisher link

10.1109/DAC18074.2021.9586127

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Shohel, M. A. A., Chhabria, V. A., & Sapatnekar, S. S. (2021). A New, Computationally Efficient 'Blech Criterion' for Immortality in General Interconnects. In 2021 58th ACM/IEEE Design Automation Conference, DAC 2021 (pp. 913-918). (Proceedings - Design Automation Conference; Vol. 2021-December). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DAC18074.2021.9586127

A New, Computationally Efficient 'Blech Criterion' for Immortality in General Interconnects. / Shohel, Mohammad Abdullah Al; Chhabria, Vidya A.; Sapatnekar, Sachin S.

2021 58th ACM/IEEE Design Automation Conference, DAC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 913-918 (Proceedings - Design Automation Conference; Vol. 2021-December).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shohel, MAA, Chhabria, VA & Sapatnekar, SS 2021, A New, Computationally Efficient 'Blech Criterion' for Immortality in General Interconnects. in 2021 58th ACM/IEEE Design Automation Conference, DAC 2021. Proceedings - Design Automation Conference, vol. 2021-December, Institute of Electrical and Electronics Engineers Inc., pp. 913-918, 58th ACM/IEEE Design Automation Conference, DAC 2021, San Francisco, United States, 12/5/21. https://doi.org/10.1109/DAC18074.2021.9586127

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abstract = "Traditional methodologies for analyzing electromigration (EM) in VLSI circuits first filter immortal wires using Blech's criterion, and then perform detailed EM analysis on the remaining wires. However, Blech's criterion was designed for two-terminal wires and does not extend to general structures. This paper demonstrates a first-principles-based solution technique for determining the steady-state stress at all the nodes of a general interconnect structure, and develops an immortality test whose complexity is linear in the number of edges of an interconnect structure. The proposed model is applied to a variety of structures. The method is shown to match well with results from numerical solvers, to be scalable to large structures.",

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A New, Computationally Efficient 'Blech Criterion' for Immortality in General Interconnects

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