A new approach to multi-layer PCB routing with short vias

J. F. Naveda, Kc Chang, H. C. Du

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

The routing problem for Printed-Circuit Boards (PCB's) is crucial in the fabrication of today's digital systems. Traditionaly, this problem has been divided into two main sub-problems: layer assignment and routing. Considering these two problems apart from each other may cause uneven wire distribution both among the wiring layers and within each layer. Uneven wire distribution among the wiring layers could increase the number of wiring surfaces required for the routing. Uneven wire distribution within a layer could result in an unfeasible routing. We propose a new approach to deal with the routing of PCB's in technologies which allow short vias. The proposed metodology considers the layer assignment and routing problems in a unified fashion. Based on some global information, our algorithm first estimates the initial number of layers required for the routing. It then determines an ordering in which nets should be considered during the layer assignment process. The results of our experiments show that our algorithm is of practical use.

Original languageEnglish (US)
Title of host publicationProceedings of the 23rd ACM/IEEE Design Automation Conference, DAC 1986
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages696-701
Number of pages6
ISBN (Print)0818607025
DOIs
StatePublished - Jul 2 1986
Event23rd ACM/IEEE Design Automation Conference, DAC 1986 - Las Vegas, United States
Duration: Jun 29 1986Jul 2 1986

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X

Other

Other23rd ACM/IEEE Design Automation Conference, DAC 1986
CountryUnited States
CityLas Vegas
Period6/29/867/2/86

Bibliographical note

Funding Information:
This research was supported in part by NSF grant DCR-8404498 and by a grant, from CDC/ Honeywell/ Sperry.

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