A new approach to multi-layer PCB routing with short vias

J. F. Naveda; Kc Chang; H. C. Du

doi:10.1109/DAC.1986.1586166

A new approach to multi-layer PCB routing with short vias

J. F. Naveda, Kc Chang, H. C. Du

Computer Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

The routing problem for Printed-Circuit Boards (PCB's) is crucial in the fabrication of today's digital systems. Traditionaly, this problem has been divided into two main sub-problems: layer assignment and routing. Considering these two problems apart from each other may cause uneven wire distribution both among the wiring layers and within each layer. Uneven wire distribution among the wiring layers could increase the number of wiring surfaces required for the routing. Uneven wire distribution within a layer could result in an unfeasible routing. We propose a new approach to deal with the routing of PCB's in technologies which allow short vias. The proposed metodology considers the layer assignment and routing problems in a unified fashion. Based on some global information, our algorithm first estimates the initial number of layers required for the routing. It then determines an ordering in which nets should be considered during the layer assignment process. The results of our experiments show that our algorithm is of practical use.

Original language	English (US)
Title of host publication	Proceedings of the 23rd ACM/IEEE Design Automation Conference, DAC 1986
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	696-701
Number of pages	6
ISBN (Print)	0818607025
DOIs	https://doi.org/10.1109/DAC.1986.1586166
State	Published - Jul 2 1986
Event	23rd ACM/IEEE Design Automation Conference, DAC 1986 - Las Vegas, United States Duration: Jun 29 1986 → Jul 2 1986

Publication series

Name	Proceedings - Design Automation Conference
ISSN (Print)	0738-100X

Other

Other	23rd ACM/IEEE Design Automation Conference, DAC 1986
Country/Territory	United States
City	Las Vegas
Period	6/29/86 → 7/2/86

Bibliographical note

Funding Information:
This research was supported in part by NSF grant DCR-8404498 and by a grant, from CDC/ Honeywell/ Sperry.

Publisher Copyright:
© 1986 IEEE.

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10.1109/DAC.1986.1586166

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A new approach to multi-layer PCB routing with short vias. / Naveda, J. F.; Chang, Kc; Du, H. C.
Proceedings of the 23rd ACM/IEEE Design Automation Conference, DAC 1986. Institute of Electrical and Electronics Engineers Inc., 1986. p. 696-701 1586166 (Proceedings - Design Automation Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Naveda, JF, Chang, K & Du, HC 1986, A new approach to multi-layer PCB routing with short vias. in Proceedings of the 23rd ACM/IEEE Design Automation Conference, DAC 1986., 1586166, Proceedings - Design Automation Conference, Institute of Electrical and Electronics Engineers Inc., pp. 696-701, 23rd ACM/IEEE Design Automation Conference, DAC 1986, Las Vegas, United States, 6/29/86. https://doi.org/10.1109/DAC.1986.1586166

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abstract = "The routing problem for Printed-Circuit Boards (PCB's) is crucial in the fabrication of today's digital systems. Traditionaly, this problem has been divided into two main sub-problems: layer assignment and routing. Considering these two problems apart from each other may cause uneven wire distribution both among the wiring layers and within each layer. Uneven wire distribution among the wiring layers could increase the number of wiring surfaces required for the routing. Uneven wire distribution within a layer could result in an unfeasible routing. We propose a new approach to deal with the routing of PCB's in technologies which allow short vias. The proposed metodology considers the layer assignment and routing problems in a unified fashion. Based on some global information, our algorithm first estimates the initial number of layers required for the routing. It then determines an ordering in which nets should be considered during the layer assignment process. The results of our experiments show that our algorithm is of practical use.",

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note = "Funding Information: This research was supported in part by NSF grant DCR-8404498 and by a grant, from CDC/ Honeywell/ Sperry. Publisher Copyright: {\textcopyright} 1986 IEEE.; 23rd ACM/IEEE Design Automation Conference, DAC 1986 ; Conference date: 29-06-1986 Through 02-07-1986",

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N2 - The routing problem for Printed-Circuit Boards (PCB's) is crucial in the fabrication of today's digital systems. Traditionaly, this problem has been divided into two main sub-problems: layer assignment and routing. Considering these two problems apart from each other may cause uneven wire distribution both among the wiring layers and within each layer. Uneven wire distribution among the wiring layers could increase the number of wiring surfaces required for the routing. Uneven wire distribution within a layer could result in an unfeasible routing. We propose a new approach to deal with the routing of PCB's in technologies which allow short vias. The proposed metodology considers the layer assignment and routing problems in a unified fashion. Based on some global information, our algorithm first estimates the initial number of layers required for the routing. It then determines an ordering in which nets should be considered during the layer assignment process. The results of our experiments show that our algorithm is of practical use.

AB - The routing problem for Printed-Circuit Boards (PCB's) is crucial in the fabrication of today's digital systems. Traditionaly, this problem has been divided into two main sub-problems: layer assignment and routing. Considering these two problems apart from each other may cause uneven wire distribution both among the wiring layers and within each layer. Uneven wire distribution among the wiring layers could increase the number of wiring surfaces required for the routing. Uneven wire distribution within a layer could result in an unfeasible routing. We propose a new approach to deal with the routing of PCB's in technologies which allow short vias. The proposed metodology considers the layer assignment and routing problems in a unified fashion. Based on some global information, our algorithm first estimates the initial number of layers required for the routing. It then determines an ordering in which nets should be considered during the layer assignment process. The results of our experiments show that our algorithm is of practical use.

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A new approach to multi-layer PCB routing with short vias

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