A mini review on thermally conductive polymers and polymer-based composites

Yanfei Xu, Xiaojia Wang, Qing Hao

Research output: Contribution to journalShort surveypeer-review

Abstract

The continuous trend of miniaturization leads to unprecedented power densities within electronic devices, which also becomes the bottleneck of the device performance. Effective cooling of electronic devices is critical and polymer-based materials may play an important role in this important direction, with advantages such as low cost, corrosion resistance, light weight, and flexibility. For thermal management applications, the intrinsically low thermal conductivities of amorphous polymers can be dramatically enhanced with strain-induced crystallization and ultra-high-conductivity fillers. In this mini review, some advancements in this field are summarized and discussed, followed by a prospective on future directions.

Original languageEnglish (US)
Article number100617
JournalComposites Communications
Volume24
DOIs
StatePublished - Apr 2021

Bibliographical note

Funding Information:
Hao and Wang thank the support from National Science Foundation (grant number CBET-1803931). Yanfei Xu thanks the Faculty Startup Fund Support from University of Massachusetts Amherst.

Publisher Copyright:
© 2021 Elsevier Ltd

Keywords

  • Filler
  • Polymer
  • Strain
  • Thermal conductivity

Fingerprint

Dive into the research topics of 'A mini review on thermally conductive polymers and polymer-based composites'. Together they form a unique fingerprint.

Cite this