A DOS-enhanced numerical simulation of heat transfer and fluid flow through an array of offset fins with conjugate heating in the bounding solid

Ephraim M. Sparrow, John P. Abraham, Paul W. Chevalier

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The method of Design of Simulation (DOS) was used to guide and enhance a numerical simulation of fluid flow and heat transfer through offset-fin arrays which form the interior geometry of a cold plate. The basic problem involved 12 independent parameters. This prohibitive parametric burden was lessened by the creative use of nondimensionalization that was brought to fruition by a special transformation of the boundary conditions. Subsequent to the reduction of the number of parameters, the DOS method was employed to limit the number of simulation runs while maintaining an accurate representation of the parameter space. The DOS method also provided excellent correlations of both the dimensionless heat transfer and pressure drop results. The results were evaluated with respect to the Colburn Analogy for heat and momentum transfer. It was found that the offseting of the fins created a larger increase in the friction factor than that which was realized for the dimensionless heat transfer coefficient.

Original languageEnglish (US)
Title of host publicationElectronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages679-692
Number of pages14
Volume3
DOIs
StatePublished - Jan 1 2003
Event2003 ASME International Mechanical Engineering Congress - Washington, DC, United States
Duration: Nov 15 2003Nov 21 2003

Other

Other2003 ASME International Mechanical Engineering Congress
CountryUnited States
CityWashington, DC
Period11/15/0311/21/03

Fingerprint

Fins (heat exchange)
Flow of fluids
Heat transfer
Heating
Computer simulation
Momentum transfer
Heat transfer coefficients
Pressure drop
Boundary conditions
Friction
Geometry

Cite this

Sparrow, E. M., Abraham, J. P., & Chevalier, P. W. (2003). A DOS-enhanced numerical simulation of heat transfer and fluid flow through an array of offset fins with conjugate heating in the bounding solid. In Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003 (Vol. 3, pp. 679-692). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2003-42380

A DOS-enhanced numerical simulation of heat transfer and fluid flow through an array of offset fins with conjugate heating in the bounding solid. / Sparrow, Ephraim M.; Abraham, John P.; Chevalier, Paul W.

Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003. Vol. 3 American Society of Mechanical Engineers (ASME), 2003. p. 679-692.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sparrow, EM, Abraham, JP & Chevalier, PW 2003, A DOS-enhanced numerical simulation of heat transfer and fluid flow through an array of offset fins with conjugate heating in the bounding solid. in Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003. vol. 3, American Society of Mechanical Engineers (ASME), pp. 679-692, 2003 ASME International Mechanical Engineering Congress, Washington, DC, United States, 11/15/03. https://doi.org/10.1115/IMECE2003-42380
Sparrow EM, Abraham JP, Chevalier PW. A DOS-enhanced numerical simulation of heat transfer and fluid flow through an array of offset fins with conjugate heating in the bounding solid. In Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003. Vol. 3. American Society of Mechanical Engineers (ASME). 2003. p. 679-692 https://doi.org/10.1115/IMECE2003-42380
Sparrow, Ephraim M. ; Abraham, John P. ; Chevalier, Paul W. / A DOS-enhanced numerical simulation of heat transfer and fluid flow through an array of offset fins with conjugate heating in the bounding solid. Electronic and Photonic Packing, Electrical Systems and Photonic Design, and Nanotechnology - 2003. Vol. 3 American Society of Mechanical Engineers (ASME), 2003. pp. 679-692
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