A 3-D miniaturization method for low-impedance designs

S. Riki Banerjee, Chenglin Zheng, Rhonda Franklin Drayton

Research output: Contribution to journalArticlepeer-review

Abstract

Microstrip interconnects with a V conductor are designed, fabricated, and measured to provide a compact solution for designs requiring low characteristic impedance lines. S-parameter curves are shown up to 35 GHz for 0.5-cm-long lines. The 308-μm-deep V structure produces a 33.8-ω line with strong standing waves and reflections under 5 dB. To further reduce the impedance, a partial shield is added that results in 6.7 times reduction of signal line width, near elimination of open-end effect, and excellent correlation with a standard 15-ω microstrip up to 25 GHz. A filter demonstration shows near ideal behavior in the 3 dB response and low return loss when compared to a similar conventional design.

Original languageEnglish (US)
Pages (from-to)200-208
Number of pages9
JournalIEEE Transactions on Advanced Packaging
Volume30
Issue number2
DOIs
StatePublished - May 1 2007

Keywords

  • Filters
  • Microstrip
  • Microstrip discontinuities
  • Stepped impedance filters

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