A 2.1 pJ/bit, 8 Gb/s Ultra-Low Power In-Package Serial Link Featuring a Time-based Front-end and a Digital Equalizer

Po Wei Chiu, Muqing Liu, Qianying Tang, Chris H. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An 8 Gb/s time-to-digital converter (TDC) based receiver with a time-based front-end in 65nm CMOS is specifically designed for in-package serial link applications. The proposed receiver converts the channel signal to a corresponding time delay which is amplified by a novel delay line based time amplifier. Next, a time-to-digital converter generates a 4-bit code which is used for digital equalization. The proposed design is digital intensive and hence highly resilient to voltage headroom and/or PVT issues. A bathtub curve and time domain eye-diagram were measured by an in-situ bit-error-rate (BER) monitor circuit. An energy-efficiency of 2.1 pJ/b was achieved at 8 Gb/s for a 7 mm link. The receiver area is 240×120μm 2 .

Original languageEnglish (US)
Title of host publication2018 IEEE Asian Solid-State Circuits Conference, A-SSCC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages187-190
Number of pages4
ISBN (Electronic)9781538664124
DOIs
StatePublished - Dec 14 2018
Event2018 IEEE Asian Solid-State Circuits Conference, A-SSCC 2018 - Tainan, Taiwan, Province of China
Duration: Nov 5 2018Nov 7 2018

Publication series

Name2018 IEEE Asian Solid-State Circuits Conference, A-SSCC 2018 - Proceedings

Other

Other2018 IEEE Asian Solid-State Circuits Conference, A-SSCC 2018
CountryTaiwan, Province of China
CityTainan
Period11/5/1811/7/18

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Keywords

  • Time-based
  • digital equalization
  • digital intensive
  • inverter-based
  • system-in-package (SiP)
  • time-to-digital converter (TDC)

Cite this

Chiu, P. W., Liu, M., Tang, Q., & Kim, C. H. (2018). A 2.1 pJ/bit, 8 Gb/s Ultra-Low Power In-Package Serial Link Featuring a Time-based Front-end and a Digital Equalizer. In 2018 IEEE Asian Solid-State Circuits Conference, A-SSCC 2018 - Proceedings (pp. 187-190). [8579267] (2018 IEEE Asian Solid-State Circuits Conference, A-SSCC 2018 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASSCC.2018.8579267