3D Microelectronics: Self-Assembled Multifunctional 3D Microdevices (Adv. Electron. Mater. 6/2016)

Daeha Joung; Kriti Agarwal; Hyeong Ryeol Park; Chao Liu; Sang Hyun Oh; Jeong Hyun Cho

doi:10.1002/aelm.201670035

3D Microelectronics: Self-Assembled Multifunctional 3D Microdevices (Adv. Electron. Mater. 6/2016)

Daeha Joung, Kriti Agarwal, Hyeong Ryeol Park, Chao Liu, Sang Hyun Oh, Jeong Hyun Cho

Electrical and Computer Engineering

Research output: Contribution to journal › Comment/debate › peer-review

Original language	English (US)
Article number	AELM201670035
Journal	Advanced Electronic Materials
Volume	2
Issue number	6
DOIs	https://doi.org/10.1002/aelm.201670035
State	Published - Jun 1 2016

Keywords

3D microstructures
THz split ring resonators
functionalization
self-assembly
surface patterning

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10.1002/aelm.201670035

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title = "3D Microelectronics: Self-Assembled Multifunctional 3D Microdevices (Adv. Electron. Mater. 6/2016)",

keywords = "3D microstructures, THz split ring resonators, functionalization, self-assembly, surface patterning",

author = "Daeha Joung and Kriti Agarwal and Park, {Hyeong Ryeol} and Chao Liu and Oh, {Sang Hyun} and Cho, {Jeong Hyun}",

year = "2016",

month = jun,

day = "1",

doi = "10.1002/aelm.201670035",

language = "English (US)",

volume = "2",

journal = "Advanced Electronic Materials",

issn = "2199-160X",

publisher = "Wiley-VCH Verlag",

number = "6",

}

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T2 - Self-Assembled Multifunctional 3D Microdevices (Adv. Electron. Mater. 6/2016)

AU - Joung, Daeha

AU - Agarwal, Kriti

AU - Park, Hyeong Ryeol

AU - Liu, Chao

AU - Oh, Sang Hyun

AU - Cho, Jeong Hyun

PY - 2016/6/1

Y1 - 2016/6/1

KW - 3D microstructures

KW - THz split ring resonators

KW - functionalization

KW - self-assembly

KW - surface patterning

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U2 - 10.1002/aelm.201670035

DO - 10.1002/aelm.201670035

M3 - Comment/debate

AN - SCOPUS:84975074579

SN - 2199-160X

VL - 2

JO - Advanced Electronic Materials

JF - Advanced Electronic Materials

IS - 6

M1 - AELM201670035

ER -

3D Microelectronics: Self-Assembled Multifunctional 3D Microdevices (Adv. Electron. Mater. 6/2016)

Keywords

Publisher link

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