3D Microelectronics: Self-Assembled Multifunctional 3D Microdevices (Adv. Electron. Mater. 6/2016)

Daeha Joung, Kriti Agarwal, Hyeong Ryeol Park, Chao Liu, Sang Hyun Oh, Jeong Hyun Cho

Research output: Contribution to journalComment/debate

Original languageEnglish (US)
Article numberAELM201670035
JournalAdvanced Electronic Materials
Volume2
Issue number6
DOIs
StatePublished - Jun 1 2016

Keywords

  • 3D microstructures
  • THz split ring resonators
  • functionalization
  • self-assembly
  • surface patterning

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