3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression

Gokul Krishnan; Gopikrishnan Raveendran Nair; Jonghyun Oh; Anupreetham Anupreetham; Pragnya Sudershan Nalla; Ahmed Hassan; Injune Yeo; Kishore Kasichainula; Jae Sun Seo; Mingoo Seok; Yu Cao

doi:10.1109/A-SSCC58667.2023.10347978

3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression

Gokul Krishnan
, Gopikrishnan Raveendran Nair
, Jonghyun Oh
, Anupreetham Anupreetham
, Pragnya Sudershan Nalla
, Ahmed Hassan
, Injune Yeo
, Kishore Kasichainula
, Jae Sun Seo
, Mingoo Seok
, Yu Cao

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Scopus citations

Abstract

A dynamic vision sensor (DVS) outputs a sequence of digital events, each representing a change in brightness at a particular time. As DVS keeps scaling down the pixel size and increasing the resolution, a larger volume of data is generated at limited bandwidth, resulting in reduced system-level throughput, as shown in Fig. 1(a). Hence, conventional interconnect solutions cannot meet the requirement of real-time data output from a high-speed DVS.

Original language	English (US)
Title of host publication	2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798350330038
DOIs	https://doi.org/10.1109/A-SSCC58667.2023.10347978
State	Published - 2023
Event	19th IEEE Asian Solid-State Circuits Conference, A-SSCC 2023 - Haikou, China Duration: Nov 5 2023 → Nov 8 2023

Publication series

Name	2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023

Conference

Conference	19th IEEE Asian Solid-State Circuits Conference, A-SSCC 2023
Country/Territory	China
City	Haikou
Period	11/5/23 → 11/8/23

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

Publisher link

10.1109/A-SSCC58667.2023.10347978

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Krishnan, G., Nair, G. R., Oh, J., Anupreetham, A., Nalla, P. S., Hassan, A., Yeo, I., Kasichainula, K., Seo, J. S., Seok, M., & Cao, Y. (2023). 3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression. In 2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023 (2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/A-SSCC58667.2023.10347978

3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression. / Krishnan, Gokul; Nair, Gopikrishnan Raveendran; Oh, Jonghyun et al.
2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Krishnan, G, Nair, GR, Oh, J, Anupreetham, A, Nalla, PS, Hassan, A, Yeo, I, Kasichainula, K, Seo, JS, Seok, M & Cao, Y 2023, 3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression. in 2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023. 2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023, Institute of Electrical and Electronics Engineers Inc., 19th IEEE Asian Solid-State Circuits Conference, A-SSCC 2023, Haikou, China, 11/5/23. https://doi.org/10.1109/A-SSCC58667.2023.10347978

Krishnan G, Nair GR, Oh J, Anupreetham A, Nalla PS, Hassan A et al. 3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression. In 2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023. Institute of Electrical and Electronics Engineers Inc. 2023. (2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023). doi: 10.1109/A-SSCC58667.2023.10347978

Krishnan, Gokul ; Nair, Gopikrishnan Raveendran ; Oh, Jonghyun et al. / 3D-ISC : A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression. 2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023. Institute of Electrical and Electronics Engineers Inc., 2023. (2023 IEEE Asian Solid-State Circuits Conference, A-SSCC 2023).

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abstract = "A dynamic vision sensor (DVS) outputs a sequence of digital events, each representing a change in brightness at a particular time. As DVS keeps scaling down the pixel size and increasing the resolution, a larger volume of data is generated at limited bandwidth, resulting in reduced system-level throughput, as shown in Fig. 1(a). Hence, conventional interconnect solutions cannot meet the requirement of real-time data output from a high-speed DVS.",

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AU - Hassan, Ahmed

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AB - A dynamic vision sensor (DVS) outputs a sequence of digital events, each representing a change in brightness at a particular time. As DVS keeps scaling down the pixel size and increasing the resolution, a larger volume of data is generated at limited bandwidth, resulting in reduced system-level throughput, as shown in Fig. 1(a). Hence, conventional interconnect solutions cannot meet the requirement of real-time data output from a high-speed DVS.

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3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression

Abstract

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