3D integration technology - Introduction and overview

Chuan Seng Tan, Steven J. Koester, Kuan Neng Chen

Research output: Chapter in Book/Report/Conference proceeding › Chapter

3 Scopus citations

Original language	English (US)
Title of host publication	3D Integration for VLSI Systems
Publisher	Pan Stanford Publishing Pte. Ltd.
Pages	1-26
Number of pages	26
ISBN (Print)	9789814303811
DOIs	https://doi.org/10.4032/9789814303828
State	Published - Sep 30 2011

Publisher link

@inbook{c6bf83c624274cf79657bda23c5a3540,

title = "3D integration technology - Introduction and overview",

author = "Tan, \{Chuan Seng\} and Koester, \{Steven J.\} and Chen, \{Kuan Neng\}",

year = "2011",

month = sep,

day = "30",

doi = "10.4032/9789814303828",

language = "English (US)",

isbn = "9789814303811",

pages = "1--26",

booktitle = "3D Integration for VLSI Systems",

publisher = "Pan Stanford Publishing Pte. Ltd.",

}

TY - CHAP

T1 - 3D integration technology - Introduction and overview

AU - Tan, Chuan Seng

AU - Koester, Steven J.

AU - Chen, Kuan Neng

PY - 2011/9/30

Y1 - 2011/9/30

UR - https://www.scopus.com/pages/publications/84881801716

UR - https://www.scopus.com/inward/citedby.url?scp=84881801716&partnerID=8YFLogxK

U2 - 10.4032/9789814303828

DO - 10.4032/9789814303828

M3 - Chapter

AN - SCOPUS:84881801716

SN - 9789814303811

SP - 1

EP - 26

BT - 3D Integration for VLSI Systems

PB - Pan Stanford Publishing Pte. Ltd.

ER -