3D integration technology-introduction and overview

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Original language	English (US)
Title of host publication	3D Integration for VLSI Systems
Publisher	Pan Stanford Publishing Pte. Ltd.
Pages	2-26
Number of pages	25
ISBN (Electronic)	9789814303828
ISBN (Print)	9789814303811
DOIs	https://doi.org/10.4032/9789814303828
State	Published - Apr 19 2016

Publisher link

@inbook{115e7e93c31045acbbfba72985ffefa7,

title = "3D integration technology-introduction and overview",

author = "Tan, \{Chuan Seng\} and Koester, \{Steven J.\} and Chen, \{Kuan Neng\}",

year = "2016",

month = apr,

day = "19",

doi = "10.4032/9789814303828",

language = "English (US)",

isbn = "9789814303811",

pages = "2--26",

booktitle = "3D Integration for VLSI Systems",

publisher = "Pan Stanford Publishing Pte. Ltd.",

}

TY - CHAP

T1 - 3D integration technology-introduction and overview

AU - Tan, Chuan Seng

AU - Koester, Steven J.

AU - Chen, Kuan Neng

PY - 2016/4/19

Y1 - 2016/4/19

UR - https://www.scopus.com/pages/publications/85052868335

UR - https://www.scopus.com/pages/publications/85052868335#tab=citedBy

U2 - 10.4032/9789814303828

DO - 10.4032/9789814303828

M3 - Chapter

AN - SCOPUS:85052868335

SN - 9789814303811

SP - 2

EP - 26

BT - 3D Integration for VLSI Systems

PB - Pan Stanford Publishing Pte. Ltd.

ER -