This paper introduces a novel 3-Dimensional (3D) vertically integrated adaptive computing system. This 3D-SoftChip is a combination of state-of-the-art processing and interconnection technology. It comprises the vertical integration of two chips (a Configurable Array Processor and an Intelligent Configurable Switch) through indium bump 3D interconnections. The Configurable Array Processor (CAP) is an array of heterogeneous processing elements (PEs) while the Intelligent Configurable Switch (ICS) comprises a switch block, 32-bit dedicated RISC processor for control, on-chip program/data memory, data frame buffer along with a Direct Memory Access (DMA) controller. This paper introduces the 3D-Softchip architecture for real-time communication and multimedia signal processing as a next gene! ration computing system. The paper further describes the up-to-date HW/SW co-design and verification methodology including high level system modeling and architecture exploration of 3D-SoftChip using SystemC in order to determine the optimum hardware specification in the early design stage.
|Original language||English (US)|
|Number of pages||1|
|State||Published - Jun 20 2005|
|Event||ACM/SIGDA Thirteenth ACM International Symposium on Field Programmable Gate Arrays - FPGA 2005 - Monterey, CA, United States|
Duration: Feb 20 2005 → Feb 22 2005
|Conference||ACM/SIGDA Thirteenth ACM International Symposium on Field Programmable Gate Arrays - FPGA 2005|
|Period||2/20/05 → 2/22/05|