3D-Carbon: An Analytical Carbon Modeling Tool for 3D and 2.5D Integrated Circuits

Yujie Zhao, Yang Katie Zhao, Cheng Wan, Yingyan Celine Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Environmental sustainability is crucial for Integrated Circuits (ICs) across their lifecycle, particularly in manufacturing and use. Meanwhile, ICs using 3D/2.5D integration technologies have emerged as promising solutions to meet the growing demands for computational power. However, there is a distinct lack of carbon modeling tools for 3D/2.5D ICs. Addressing this, we propose 3D-Carbon, an analytical carbon modeling tool designed to quantify the carbon emissions of 3D/2.5D ICs throughout their life cycle. 3D-Carbon factors in both potential savings and overheads from advanced integration technologies, considering practical deployment constraints like bandwidth. We validate 3D-Carbon's accuracy against established baselines and illustrate its utility through case studies in autonomous vehicles. We believe that 3D-Carbon lays the initial foundation for future innovations in developing environmentally sustainable 3D/2.5D ICs. Our open-source code is available at https://github.com/UMN-ZhaoLab/3D-Carbon.

Original languageEnglish (US)
Title of host publicationProceedings of the 61st ACM/IEEE Design Automation Conference, DAC 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798400706011
DOIs
StatePublished - Nov 7 2024
Event61st ACM/IEEE Design Automation Conference, DAC 2024 - San Francisco, United States
Duration: Jun 23 2024Jun 27 2024

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X

Conference

Conference61st ACM/IEEE Design Automation Conference, DAC 2024
Country/TerritoryUnited States
CitySan Francisco
Period6/23/246/27/24

Bibliographical note

Publisher Copyright:
© 2024 Copyright is held by the owner/author(s). Publication rights licensed to ACM.

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