Abstract
Environmental sustainability is crucial for Integrated Circuits (ICs) across their lifecycle, particularly in manufacturing and use. Meanwhile, ICs using 3D/2.5D integration technologies have emerged as promising solutions to meet the growing demands for computational power. However, there is a distinct lack of carbon modeling tools for 3D/2.5D ICs. Addressing this, we propose 3D-Carbon, an analytical carbon modeling tool designed to quantify the carbon emissions of 3D/2.5D ICs throughout their life cycle. 3D-Carbon factors in both potential savings and overheads from advanced integration technologies, considering practical deployment constraints like bandwidth. We validate 3D-Carbon's accuracy against established baselines and illustrate its utility through case studies in autonomous vehicles. We believe that 3D-Carbon lays the initial foundation for future innovations in developing environmentally sustainable 3D/2.5D ICs. Our open-source code is available at https://github.com/UMN-ZhaoLab/3D-Carbon.
Original language | English (US) |
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Title of host publication | Proceedings of the 61st ACM/IEEE Design Automation Conference, DAC 2024 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9798400706011 |
DOIs | |
State | Published - Nov 7 2024 |
Event | 61st ACM/IEEE Design Automation Conference, DAC 2024 - San Francisco, United States Duration: Jun 23 2024 → Jun 27 2024 |
Publication series
Name | Proceedings - Design Automation Conference |
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ISSN (Print) | 0738-100X |
Conference
Conference | 61st ACM/IEEE Design Automation Conference, DAC 2024 |
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Country/Territory | United States |
City | San Francisco |
Period | 6/23/24 → 6/27/24 |
Bibliographical note
Publisher Copyright:© 2024 Copyright is held by the owner/author(s). Publication rights licensed to ACM.