TY - GEN
T1 - 14.6 A scalable THz 2D phased array with +17dBm of EIRP at 338GHz in 65nm bulk CMOS
AU - Tousi, Yahya
AU - Afshari, Ehsan
PY - 2014
Y1 - 2014
N2 - There is an untapped market for integrated high-resolution imaging and spectroscopy at mm-Wave and THz frequencies. Some novel approaches have been recently proposed to render on-chip signal generation and transmission at these frequencies [1-4]. However, as the frequency approaches the physical limitations of the device, self-sustained oscillation becomes increasingly difficult and the generated power fades away. Fortunately, the limited power from individual devices can be offset by coherent power-combining of multiple sources. A desirable mechanism to generate high power levels above the fmax, has to provide a solution that first, enables a scalable approach to generate and combine the maximum available power from individual sources and second, ensures controllable phase shift between multiple sources in order to provide beam steering at any desired direction.
AB - There is an untapped market for integrated high-resolution imaging and spectroscopy at mm-Wave and THz frequencies. Some novel approaches have been recently proposed to render on-chip signal generation and transmission at these frequencies [1-4]. However, as the frequency approaches the physical limitations of the device, self-sustained oscillation becomes increasingly difficult and the generated power fades away. Fortunately, the limited power from individual devices can be offset by coherent power-combining of multiple sources. A desirable mechanism to generate high power levels above the fmax, has to provide a solution that first, enables a scalable approach to generate and combine the maximum available power from individual sources and second, ensures controllable phase shift between multiple sources in order to provide beam steering at any desired direction.
UR - http://www.scopus.com/inward/record.url?scp=84898073777&partnerID=8YFLogxK
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U2 - 10.1109/ISSCC.2014.6757425
DO - 10.1109/ISSCC.2014.6757425
M3 - Conference contribution
AN - SCOPUS:84898073777
SN - 9781479909186
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 258
EP - 259
BT - 2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers
T2 - 2014 61st IEEE International Solid-State Circuits Conference, ISSCC 2014
Y2 - 9 February 2014 through 13 February 2014
ER -