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Chip Level Self-Assembly: Tools and Components that self
Jacobs, Heinrich O
(PI)
Electrical and Computer Engineering
Project
:
Research project
Overview
Project Details
Description
Chip Level Self-Assembly: Tools and Components that self-assemble and self-package to form desired microsystems
Status
Finished
Effective start/end date
5/1/03
→
11/30/07
Funding
National Science Foundation
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