Project Details
Description
The heat transfer path from the electronic component to the nearby surrounding air is becoming the limiting factor in the design for air cooling of high-performance electronic equipment. Using air as the cooling medium is the most desirable cooling metho
| Status | Finished |
|---|---|
| Effective start/end date | 1/1/09 → 6/30/12 |
Funding
- Thermacore, Inc.
- USDOD DEFENSE ADV RES PROJECTS
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