Active Heat Sink Technologies

Project: Research project

Description

The heat transfer path from the electronic component to the nearby surrounding air is becoming the limiting factor in the design for air cooling of high-performance electronic equipment. Using air as the cooling medium is the most desirable cooling metho
StatusFinished
Effective start/end date1/1/096/30/12

Funding

  • Thermacore, Inc.

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Electronic equipment
Heat transfer
Cooling
Air