No photo of Yongzhi Qu
Contact Expert

View Scopus Profile

Yongzhi Qu

20132020

Research output per year

If you made any changes in Pure these will be visible here soon.

Fingerprint The Fingerprint is created by mining the titles and abstracts of the person's research outputs and projects/funding awards to create an index of weighted terms from discipline-specific thesauri.

  • 1 Similar Profiles

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output

A domain adaptation model for early gear pitting fault diagnosis based on deep transfer learning network

Li, J., Li, X., He, D. & Qu, Y., Feb 1 2020, In : Proceedings of the Institution of Mechanical Engineers, Part O: Journal of Risk and Reliability. 234, 1, p. 168-182 15 p.

Research output: Contribution to journal › Article

    • 3 Scopus citations

    Gear pitting fault diagnosis with mixed operating conditions based on adaptive 1D separable convolution with residual connection

    Li, X., Li, J., Zhao, C., Qu, Y. & He, D., Aug 2020, In : Mechanical Systems and Signal Processing. 142, 106740.

    Research output: Contribution to journal › Article

    • 2 Scopus citations

    Semi-supervised gear fault diagnosis using raw vibration signal based on deep learning

    LI, X., LI, J., QU, Y. & HE, D., Feb 2020, In : Chinese Journal of Aeronautics. 33, 2, p. 418-426 9 p.

    Research output: Contribution to journal › Article

    Open Access
    • 4 Scopus citations

    Unsupervised rotating machinery fault diagnosis method based on integrated SAE–DBN and a binary processor

    Li, J., Li, X., He, D. & Qu, Y., Jan 1 2020, (Accepted/In press) In : Journal of Intelligent Manufacturing.

    Research output: Contribution to journal › Article

    • 1 Scopus citations

    An FBG based smart clamp fabricated by 3D printing technology and its application to incipient clamp looseness detection

    Wang, Z., Liu, M., Qu, Y., Wei, Q., Zhou, Z., Tan, Y., Hong, L. & Zhang, J., Jun 2019, 2019 IEEE International Conference on Prognostics and Health Management, ICPHM 2019. Institute of Electrical and Electronics Engineers Inc., 8819399. (2019 IEEE International Conference on Prognostics and Health Management, ICPHM 2019).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution