1992 …2024

Research activity per year

Network

J. O. Chu

  • IBM
  • University of Illinois at Urbana-Champaign
  • Space and Naval Warfare Systems Center
  • IBM Semiconduct. Res./Devmt. Center

External person

J. A. Ott

  • IBM
  • Space and Naval Warfare Systems Center
  • IBM Semiconduct. Res./Devmt. Center

External person

Nazila Haratipour

  • University of Minnesota
  • Intel
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Wilfried Haensch

  • IBM
  • IBM Research

External person

P. Mooney

  • IBM
  • Space and Naval Warfare Systems Center

External person

Matthew C. Robbins

  • University of Minnesota
  • Honeywell
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Gabriel Dehlinger

  • Infineon Technologies Austria AG
  • IBM

External person

K. A. Jenkins

  • IBM
  • IBM Research
  • Space and Naval Warfare Systems Center

External person

Kuan Neng Chen

  • National Yang Ming Chiao Tung University
  • IBM

External person

D. F. Canaperi

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

R. Hammond

  • IBM
  • Amberwave Systems Corporation
  • University of Illinois at Urbana-Champaign
  • Space and Naval Warfare Systems Center

External person

Yoska Anugrah

  • University of Minnesota
  • Department of Electrical and Computer Engineering
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Laurent Schares

  • IBM
  • IBM Research
  • IEEE

External person

Richard A. John

  • IBM
  • IBM Research

External person

Clint L. Schow

  • IBM
  • IBM Research

External person

Mona A. Ebrish

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Jiaxi Hu

  • University of Minnesota
  • Apple
  • Department of Electrical and Computer Engineering
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

L. Shi

  • IBM
  • IBM Research
  • IBM Semiconduct. Res./Devmt. Center

External person

K. Rim

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

Chaitanya Kshirsagar

  • University of Minnesota
  • University of Minnesota

External person

Albert Young

  • IBM
  • IBM Research

External person

J. Cai

  • IBM
  • Department of Design and Technology Solutions

External person

Nathan Youngblood

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

David A. Deen

  • Seagate Technology
  • University of Minnesota
  • Honeywell Quantum Solutions
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Chuan Seng Tan

  • Nanyang Technological University

External person

M. Sousa

  • IBM Zurich Research Laboratory
  • IBM
  • IBM Switzerland Ltd

External person

D. J. Webb

  • IBM Zurich Research Laboratory

External person

S. Purushothaman

  • IBM Research
  • IBM

External person

H. S Philip Wong

  • IBM
  • IEEE
  • Stanford University

External person

R. Germann

  • IBM Zurich Research Laboratory

External person

M. J. Rooks

  • IBM
  • Yale Institute of Nanoscience and Quantum Engineering
  • Cornell University
  • Yale University
  • University of California at Santa Barbara
  • National Nanofabrication Facility at Cornell
  • Department of Electrical and Computer Engineering
  • Department of Applied Physics
  • Yale University

External person

N. Klymko

  • Microelectronics Division
  • IBM
  • IBM Research
  • IBM Semiconduct. Res./Devmt. Center

External person

J. Fompeyrine

  • IBM Zurich Research Laboratory

External person

Yang Su

  • University of Minnesota
  • University of Minnesota

External person

Ronald D. Schrimpf

  • Vanderbilt University
  • IEEE
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science Department

External person

I. Lauer

  • IBM
  • Department of Design and Technology Solutions

External person

S. Koswatta

  • IBM
  • University of Notre Dame
  • Midwest Institute for Nanoelectronics Discovery (MIND
  • Midwestern Institute for Nanoelectronic Discovery (MIND)

External person

Eric J. Olson

  • University of Minnesota
  • Department of Chemistry and Supercomputing Institute
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

K. Chan

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

C. R. Bolognesi

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering

External person

M. Ieong

  • IBM
  • Global Foundries, Inc.
  • IBM Semiconduct. Res./Devmt. Center

External person

F. Liu

  • IBM Research
  • IBM

External person

P. R. de la Houssaye

  • IBM
  • Space and Naval Warfare Systems Center

External person

Roy R. Yu

  • IBM
  • IBM Research

External person

X. Gu

  • IBM
  • Ericsson AB
  • IBM Research

External person

Xue V. Zhen

  • University of Minnesota
  • Boston Scientific
  • University of Minnesota

External person

Wu Lu

  • University of Illinois at Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Microelectronics Laboratory
  • University of Illinois

External person

L. Chang

  • IBM
  • Department of Design and Technology Solutions

External person

J. P. Locquet

  • IBM Zurich Research Laboratory

External person

Daniel M. Fleetwood

  • Vanderbilt University
  • IEEE
  • Electrical Engineering and Computer Science Department

External person

Ilesanmi Adesida

  • University of Illinois at Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Microelectronics Laboratory
  • University of Illinois

External person

I. Lagnado

  • IBM
  • Space and Naval Warfare Systems Center

External person

Xie Wen Wang

  • Yale University
  • University of Illinois at Urbana-Champaign
  • IEEE
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Yale University

External person

L. Perraud

  • IBM
  • Space and Naval Warfare Systems Center

External person

G. Stecklein

  • University of Minnesota
  • Pomona College
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

John D. Cressler

  • Georgia Institute of Technology
  • IEEE

External person

Tso Ping Ma

  • Yale University
  • University of Illinois at Urbana-Champaign
  • IEEE
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Yale University

External person

H. Kroemer

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering

External person

V. R Saran Kumar Chaganti

  • University of Minnesota
  • University of Minnesota
  • Intel

External person

Ryan J. Wu

  • University of Minnesota
  • Department of Chemical Engineering and Material Science
  • Department of Chemical Engineering and Material Science
  • University of California
  • Department of Materials Science and Engineering
  • University of Minnesota Twin Cities
  • University of Minnesota
  • Department of Chemistry and Materials Science and Engineering, University of California

External person

David Dobuzinsky

  • IBM
  • Global Foundries, Inc.
  • IBM Research
  • IBM Microelectronics

External person

M. Luisier

  • Swiss Federal Institute of Technology Zurich
  • Purdue University

External person

Yogish C. Kudva

  • Mayo Clinic
  • Mayo College of Medicine
  • Department of Internal Medicine
  • Department of Internal Medicine
  • Division of Endocrinology and Metabolism
  • Division of Endocrinology, Diabetes, Metabolism, and Nutrition
  • Department of Endocrinology
  • Division of Endocrinology
  • Human Cell Therapy Laboratory
  • Division of Endocrinology, Diabetes Nutrition, and Metabolism
  • Department of Medicine
  • Department of Medicine
  • William J. von Liebig Transplant Center
  • Division of Hematology and Transplant Center
  • Mayo Clinic College of Medicine and Science

External person

C. Liang

  • Vanderbilt University
  • Electrical Engineering and Computer Science Department

External person

V. R. Saran Kumar Chaganti

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

D. Boyd

  • IBM
  • Microelectronics Division
  • Global Foundries, Inc.
  • IBM Semiconduct. Res./Devmt. Center

External person

E. L. Hu

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering
  • School of Engineering and Applied Sciences
  • Harvard University

External person

T. Kanarsky

  • IBM
  • Global Foundries, Inc.

External person

Levente J. Klein

  • University of Wisconsin
  • IBM
  • Department of Physics
  • Dept. of Physics
  • Department of Chemical and Biological Engineering, University of Wisconsin-Madison

External person

Anuj Madan

  • Georgia Institute of Technology
  • IEEE

External person

Yulong Li

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Che Chen

  • University of Minnesota
  • University of Washington
  • Department of Electrical and Computer Engineering
  • University of Minnesota
  • University of Washington

External person

Shaloo Rakheja

  • Department of Electrical and Computer Engineering
  • New York University
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Michael L. Alles

  • Vanderbilt University
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science Department

External person

F. Cardone

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

P. Ronsheim

  • IBM
  • Global Foundries, Inc.
  • IBM Research
  • IBM Semiconduct. Res./Devmt. Center

External person

K. Lee

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

C. S. Webster

  • IBM
  • Agilent Technologies
  • Global Foundries, Inc.

External person

Elahe Yarmoghaddam

  • Department of Electrical and Computer Engineering
  • New York University

External person

R. M. Anderson

  • IBM
  • Global Foundries, Inc.

External person

James Kolodzey

  • University of Delaware
  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory

External person

C. Marchiori

  • IBM Zurich Research Laboratory

External person

Gregory Sherwood

  • Boston Scientific

External person

Max C. Lemme

  • RWTH Aachen University
  • AMO GmbH

External person

Zhibin Ren

  • IBM
  • Global Foundries, Inc.
  • IBM Research
  • IBM Microelectronics

External person

H. Chen

  • IBM
  • Global Foundries, Inc.

External person

R. Joynt

  • University of Wisconsin
  • University of Minnesota
  • Department of Physics
  • Dept. of Physics
  • Department of Physics and Applied Superconductivity Center
  • Physics Department
  • Department of Chemical and Biological Engineering, University of Wisconsin-Madison

External person

E. X. Zhang

  • Electrical Engineering and Computer Science Department
  • Vanderbilt University

External person

Keith Slinker

  • University of Wisconsin
  • Department of Physics
  • Dept. of Physics
  • Department of Chemical and Biological Engineering, University of Wisconsin-Madison

External person

Charles Tahan

  • University of Wisconsin
  • Department of Physics
  • Dept. of Physics
  • Department of Chemical and Biological Engineering, University of Wisconsin-Madison

External person

Eric Pop

  • Stanford University
  • Stanford University

External person

Eugene Fitzgerald

  • Massachusetts Institute of Technology

External person

K. T. Shiu

  • Princeton University
  • Department of Electrical Engineering
  • Princeton Institute for the Science and Technology of Materials (PRISM)
  • Princeton University

External person

Mark A. Eriksson

  • University of Wisconsin
  • Department of Physics

External person

H. Zhu

  • Global Foundries, Inc.
  • IBM

External person

Almaz Kuliev

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Microelectronics Laboratory
  • University of Illinois

External person

Mark Friesen

  • University of Wisconsin
  • Department of Physics
  • Dept. of Physics
  • Department of Chemical and Biological Engineering, University of Wisconsin-Madison

External person

C. L. Hinkle

  • University of Notre Dame
  • University of Notre Dame

External person

Chin Sheng Pang

  • Purdue University
  • Purdue University

External person

Aaron D. Franklin

  • Duke University
  • Duke University

External person

Peiqi Wang

  • University of California Los Angeles

External person

Joshua B. Edel

  • Imperial College London
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry

External person

Yoonmyung Lee

  • University of Michigan
  • Department of Electrical Engineering and Computer Science
  • Elec. Eng. and Comp. Sci. Dept.

External person

Joerg Appenzeller

  • Purdue University
  • Network for Computational Nanoelectronics
  • Birck Nanotechnology Center
  • Purdue University

External person

Chao Liu

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

A. V. Osinsky

  • Corning Incorporated
  • Agnitron Technology Incorporated

External person

J. Arnold

  • IBM Reaserch Division
  • IBM Research

External person

Ayan Paul

  • University of Minnesota
  • Qualcomm Incorporated
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

E. D. Perfecto

  • IBM
  • IBM Research

External person

Susan N. Coppersmith

  • University of Wisconsin
  • Department of Physics
  • Dept. of Physics
  • Department of Chemical and Biological Engineering, University of Wisconsin-Madison

External person

Daeyeon Kim

  • University of Michigan
  • Department of Electrical Engineering and Computer Science
  • Elec. Eng. and Comp. Sci. Dept.

External person

Weichao Xu

  • University of Minnesota
  • University of Minnesota

External person

Fikadu Alema

  • Agnitron Technology Incorporated

External person

Davood Shahrjerdi

  • New York University

External person

P. Saunders

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

Dennis Sylvester

  • University of Michigan
  • Eta Kappa Nu
  • IEEE
  • ACM
  • American Society for Engineering Education
  • Department of Electrical Engineering and Computer Science
  • Department of EECS
  • Department of Electrical Engineering
  • Elec. Eng. and Comp. Sci. Dept.
  • University of Michigan Health Systems
  • University of California
  • Synopsys Inc.
  • UCLA CS Dept.
  • Univ. of Michigan

External person

Son T. Le

  • National Institute of Standards and Technology
  • Theiss Research

External person

Aron Szabo

  • Swiss Federal Institute of Technology Zurich

External person

Justin T. Nelson

  • Boston Scientific

External person

Bingzhe Li

  • University of Minnesota
  • Oklahoma State University
  • Oklahoma State University
  • Oklahoma State University
  • University of Minnesota Twin Cities
  • Oklahoma State University
  • Oklahoma State University
  • University of Minnesota
  • University of Texas at Dallas

External person

W. B. Dubbelday

  • Space and Naval Warfare Systems Center

External person

P. Tomasini

  • ASM America
  • ASM International NV

External person

Zhihui Cheng

  • National Institute of Standards and Technology
  • Purdue University
  • Purdue University

External person

Zhihong Chen

  • Purdue University
  • Purdue University

External person

David T. Blaauw

  • University of Michigan
  • Motorola
  • Elec. Eng. and Comp. Sci. Dept.
  • Department of Electrical Engineering and Computer Science
  • Department of EECS
  • Department of Electrical Engineering and Computer Science
  • Univ. of Michigan

External person

Yanqing Wu

  • IBM
  • Huazhong University of Science and Technology
  • Wuhan National High Magnetic Field Center
  • Peking University

External person

X. Duan

  • University of California Los Angeles
  • Department of Chemistry and Biochemistry
  • California NanoSystems Institute

External person

Paul W. Marshall

  • NASA Goddard Space Flight Center
  • University of Colorado Boulder
  • Consultant to NASA-GSFC
  • IEEE
  • Department of Computer Science

External person

Lian Mao Peng

  • Key Laboratory for the Physics and Chemistry of Nanodevices

External person

Judson R. Holt

  • IBM
  • Global Foundries, Inc.
  • IBM Microelectronics

External person

Phaedon Avouris

  • IBM
  • National Academy of Sciences
  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Yao Zhang

  • University of Minnesota

External person

Yeqing Lu

  • University of Notre Dame
  • Midwest Institute for Nanoelectronics Discovery (MIND
  • Department of Electrical Engineering

External person

R. A. Groves

  • IBM
  • Global Foundries, Inc.

External person

S. G. Thomas

  • ASM America
  • ASM International NV

External person

James Sturm

  • Princeton University
  • Princeton Institute for the Science and Technology of Materials (PRISM)
  • Princeton Institute for the Science and Technology of Materials (PRISM)
  • Princeton University

External person

M. Hargrove

  • IBM
  • Global Foundries, Inc.

External person

A. Mocuta

  • IBM
  • Global Foundries, Inc.

External person

Curt A. Richter

  • National Institute of Standards and Technology

External person

Raj Venigalla

  • IBM
  • Global Foundries, Inc.
  • IBM Microelectronics

External person

Warren M. Porter

  • University of Minnesota
  • Biophysical Sciences and Medical Physics Doctoral Program
  • Biophysical Sciences and Medical Physics Program
  • University of Wisconsin
  • University of Minnesota Twin Cities

External person

Michael Niemier

  • University of Notre Dame
  • Notre Dame University
  • Department of Computer Science and Engineering
  • University of Notre Dame

External person

H. Iwai

  • Tokyo Institute of Technology

External person

Adonica De Los Santos

  • University of Texas Rio Grande Valley

External person

J. C Y Dunn

  • Cancer Institute of New Jersey
  • Harvard University
  • IBM

External person

Jiong Jiong Mo

  • Georgia Institute of Technology

External person

Y. Su

  • University of Minnesota

External person

Renata M M Wentzcovich

  • University of Minnesota
  • Department of Chemical Engineering and Material Science
  • Department of Chemical Engineering and Material Science

External person

Bongim Jun

  • Georgia Institute of Technology
  • IEEE

External person

Andrea Centrone

  • National Institute of Standards and Technology

External person

Vivek Saraswat

  • University of Wisconsin

External person

C. T. Ryan

  • IBM Research

External person

A. G. Merryman

  • IBM
  • IBM Research

External person

M. Wetzel

  • University of California at San Diego
  • Department of Electrical Engineering

External person

S. Takagi

  • University of Tokyo

External person

Jeff J.P.M. Schulpen

  • Eindhoven University at Technology

External person

A. Patlach

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering

External person

R. Frisenda

  • CSIC - Institute of Materials Science in Madrid

External person

B. To

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

Han Wang

  • University of Southern California

External person

Huairuo Zhang

  • National Institute of Standards and Technology
  • Materials Science and Engineering Division
  • Theiss Research

External person

Yang Su

  • University of Minnesota

External person

D. Mocuta

  • Global Foundries, Inc.

External person

Yang Su

  • University of Minnesota

External person

Jing Li

  • University of Minnesota

External person

S. H. Song

  • Purdue University
  • Birck Nanotechnology Center
  • Institute for Basic Science
  • Sookmyung Women's University
  • Purdue University

External person

E. Duch

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

Jean Olivier Plouchart

  • IBM
  • Global Foundries, Inc.

External person

Ageeth A. Bol

  • IBM
  • Eindhoven University at Technology
  • University of Michigan

External person

G. Bazán

  • University of Notre Dame
  • Department of Electrical Engineering
  • University of Notre Dame

External person

Jung U. Yoon

  • Massachusetts Institute of Technology

External person

M. S. Strano

  • Rice University
  • University of Illinois at Urbana-Champaign
  • Department of Chemistry
  • Center for Nanoscale Science and Technology
  • Center for Biological and Environmental Nanotechnology
  • Department of Chemical and Biomolecular Engineering
  • Rice Quantum Institute
  • Department of Chemical and Biomolecular Engineering
  • Massachusetts Institute of Technology
  • Massachusetts Institute of Technology, Department of Mechanical Engineering

External person

D. Ralston

  • University of California at San Diego
  • Department of Electrical Engineering

External person

Anand Raghunathan

  • Purdue University
  • School of Electrical and Computer Engineering

External person

Yue Liu

  • University of Minnesota

External person

John R. Williams

  • Auburn University
  • University of Illinois at Urbana-Champaign

External person

Young Duck Kim

  • Columbia University
  • Department of Mechanical Engineering
  • Kyung Hee University
  • Department of Physics
  • Columbia University

External person

A. Steegen

  • IBM
  • Global Foundries, Inc.

External person

I. Babich

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

Sangfeng Wu

  • University of Washington
  • Department of Physics

External person

G. Vaidhyanathan

  • University of Minnesota

External person

Andres Castellanos-Gomez

  • Instituto Madrileño de Estudios Avanzados en Nanociencia
  • CSIC - Institute of Materials Science in Madrid
  • Instituto IMDEA Nanociencia

External person

Bingchen Deng

  • Yale University
  • Department of Electrical Engineering

External person

Xinlin Wang

  • IBM
  • Global Foundries, Inc.
  • IBM Research
  • IBM Microelectronics

External person

J. Muroto

  • Tohoku University

External person

Palash Bharadwaj

  • Swiss Federal Institute of Technology Zurich
  • Rice University
  • Photonics Laboratory
  • Dept. of Elec. and Comp. Engineering
  • Rice University

External person

Kyoungmin Min

  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering

External person

L. Tai

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

A. J. Chaves

  • Instituto Tecnologico de Aeronautica
  • University of Minho

External person

P. Wang

  • Vanderbilt University
  • Electrical Engineering and Computer Science Department

External person

S. E. Zhao

  • Electrical Engineering and Computer Science Department
  • Vanderbilt University

External person

B. Brar

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering

External person

B. Ghyselen

  • Universite de Haute Alsace
  • Soitec S.A.

External person

Yanqing Wu

  • Peking University

External person

Hans A. Bechtel

  • Lawrence Berkeley National Laboratory

External person

Y. Zhang

  • IBM
  • Los Alamos National Laboratory
  • IBM Semiconduct. Res./Devmt. Center

External person

X. Wang

  • IBM Research

External person

Jurgen Michel

  • Massachusetts Institute of Technology

External person

E. P. Gusev

  • Qualcomm Incorporated

External person

A. Chaves

  • Universidade Federal do Ceara
  • Columbia University
  • University of Minho
  • Departamento de Física
  • Department of Chemistry
  • Departamento de Fisica
  • University of Antwerp

External person

Hao Jiang

  • University of Massachusetts
  • Department of Electrical and Computer Engineering

External person

Michael S. Arnold

  • University of Wisconsin
  • Department of Materials Science and Engineering
  • Department of Chemical and Biological Engineering, University of Wisconsin-Madison

External person

Cong Ma

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Michael J. Lyden

  • Boston Scientific

External person

Uttam Singisetti

  • SUNY Buffalo
  • University at Buffalo

External person

J. T. Teherani

  • Massachusetts Institute of Technology
  • Columbia University

External person

A. O'Hara

  • Vanderbilt University
  • Department of Physics and Astronomy

External person

Thomas L. Williams

  • Boston Scientific

External person

Huiqi Gong

  • Vanderbilt University
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science Department

External person

Zheng Liu

  • Nanyang Technological University
  • National Institute of Advanced Industrial Science and Technology

External person

K. Andre Mkhoyan

  • University of Minnesota
  • Johns Hopkins University
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

N. Zamdmer

  • IBM
  • Global Foundries, Inc.

External person

Priyabrata Mukherjee

  • Mayo Clinic
  • Mayo College of Medicine

External person

K. Ni

  • Vanderbilt University
  • Electrical Engineering and Computer Science Department

External person

Bivek Bista

  • University of Connecticut
  • University of Connecticut

External person

E. R. Kinser

  • IBM
  • IBM Research

External person

Jifeng Liu

  • Dartmouth College

External person

P. Oldiges

  • IBM
  • Global Foundries, Inc.

External person

Manish Chhowalla

  • Cancer Institute of New Jersey
  • Rutgers - The State University of New Jersey
  • Materials Science and Engineering
  • University of Cambridge
  • International Collaborative Laboratory of 2D Materials for Optoelectronics Science and Technology
  • Shenzhen University
  • Department of Materials Science & Metallurgy
  • Department of Materials Science and Engineering

External person

Narayana R. Aluru

  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering

External person

M. Hassan Najafi

  • School of Computing and Informatics
  • University of Louisiana at Lafayette
  • University of Minnesota

External person

Hussain Alsalman

  • University of Minnesota
  • King Abdulaziz City for Science and Technology
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Rebecca A. Dawley

  • University of Michigan

External person

Michelle A. Smeaton

  • University of Minnesota
  • University of Minnesota Twin Cities
  • Cornell University
  • University of Minnesota

External person

Binoy Paulose Nadappuram

  • Imperial College London
  • Department of Chemistry

External person

Min Seok Jang

  • Korea Advanced Institute of Science and Technology
  • School of Electrical Engineering

External person

Utkan Demirci

  • Stanford University
  • Department of Radiology
  • Stanford University

External person

Joshua R. Uzarski

  • U.S. Army Combat Capabilities Development Command Soldier Center

External person

Vy Tran

  • University of Washington
  • Stanford University
  • Washington University St. Louis
  • Department of Physics
  • Department of Radiology

External person

Yao Zhang

  • University of Minnesota

External person

E. J. Caine

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering

External person

M. S. Chace

  • IBM
  • IBM Research

External person

Xinran Wang

  • Nanjing University

External person

Hatice Altug

  • Swiss Federal Institute of Technology Lausanne
  • École Polytechnique Fédérale de Lausanne (EPFL)
  • Institute of BioEngineering
  • Institute of Bioengineering
  • Bioengineering Department

External person

Rui Ma

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Yan Wang

  • Rutgers - The State University of New Jersey
  • University of Cambridge
  • Department of Materials Science and Engineering

External person

D. A. Hennan

  • IBM
  • Global Foundries, Inc.

External person

C. A. Ross

  • Massachusetts Institute of Technology
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Massachusetts Institute of Technology, Department of Mechanical Engineering

External person

P. Kozlowski

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

Mike Freking

  • Boston Scientific

External person

Guanyu Zhou

  • University of Notre Dame

External person

B. H. Lee

  • Global Foundries, Inc.

External person

P. J. Timans

  • Mattson Technology Inc.
  • Mattson Technology, Inc.

External person

Jing Li

  • University of Minnesota

External person

Steven R. Spurgeon

  • Drexel University
  • Pacific Northwest National Laboratory
  • University of Washington
  • Drexel University College of Engineering

External person

Bethany E. Matthews

  • Pacific Northwest National Laboratory

External person

Nazila Harati Pour

  • University of Minnesota

External person

D. Brown

  • IBM Research

External person

B. Vyne

  • ASM America
  • ASM International NV

External person

Li Yang

  • University of Washington
  • Washington University St. Louis
  • Department of Physics

External person

Aravind Appaswamy

  • Georgia Institute of Technology
  • IEEE

External person

Qin Zhang

  • University of Notre Dame
  • Karolinska Institutet
  • Department of Electrical Engineering
  • Department of Neuroscience

External person

X. Li

  • IBM Research

External person

David M. Isaacson

  • Massachusetts Institute of Technology
  • IBM
  • Dept. of Mat. Sci. and Engineering
  • Massachusetts Institute of Technology, Department of Mechanical Engineering

External person

Cindy H.X. Lam

  • Eindhoven University at Technology

External person

A. Seabaugh

  • Midwest Institute for Nanoelectronics Discovery (MIND
  • University of Notre Dame
  • Department of Electrical Engineering

External person

D. Liepmann

  • University of California

External person

Cheng Li

  • Yale University

External person

Kaushik Roy

  • Purdue University
  • University of Minnesota
  • Department of Electrical and Computer Engineering
  • Sch. of Elec./Computer Engineering
  • Department of Electrical Engineering
  • School of ECE
  • School of Electrical and Computer Engineering

External person

M. S. Gordon

  • Harvard University
  • IBM
  • University of Minnesota

External person

Qiangfei Xia

  • University of Massachusetts

External person

P. Wang

  • Electrical Engineering and Computer Science Department
  • Vanderbilt University

External person

G. H. Bernstein

  • University of Notre Dame
  • Department of Electrical Engineering
  • University of Notre Dame

External person

Ananda Basu

  • Mayo Clinic
  • Division of Endocrinology

External person

Daowei He

  • Nanjing University
  • University of California Los Angeles

External person

Roger Loo

  • University of Minnesota

External person

M. Steen

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

Ramasamy Paulmurugan

  • Rajiv Gandhi Centre for Biotechnology
  • Division of Cancer Biology
  • Stanford University

External person

W. Porod

  • University of Notre Dame
  • Department of Electrical Engineering
  • University of Notre Dame

External person

K. L. Ryder

  • Vanderbilt University
  • Electrical Engineering and Computer Science Department

External person

Roland K. Kawakami

  • The Ohio State University
  • University of California at Riverside
  • Department of Physics
  • Materials Science and Engineering Program
  • University of California

External person

Seungjun Lee

  • Kyung Hee University
  • University of Minnesota
  • University of Minnesota

External person

Fazel Zare Bidoky

  • University of Minnesota
  • DuPont
  • University of Minnesota

External person

Tamara Isaacs-Smith

  • Auburn University

External person

Igor Evangelista

  • University of Delaware

External person

X. Sharon Hu

  • University of Notre Dame
  • Department of Computer Science and Engineering

External person

Steven J. May

  • Drexel University
  • Drexel University College of Engineering

External person

V. Mazzeo

  • IBM
  • Global Foundries, Inc.

External person

H. Zhu

  • IBM
  • IBM Research
  • IBM Semiconduct. Res./Devmt. Center

External person

Xiaomu Wang

  • Yale University
  • Department of Electrical Engineering

External person

Aleksandar P. Ivanov

  • Imperial College London
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry

External person

R. A. Reed

  • Vanderbilt University
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science Department

External person

Judy J. Cha

  • Yale University
  • Cornell University
  • Department of Mechanical Engineering and Materials Science

External person

Huili Grace Xing

  • University of Notre Dame
  • Department of Electrical Engineering

External person

V. Renugopalakrishnan

  • Harvard University
  • Northeastern University
  • Boston Children's Hospital

External person

Jerome Cann

  • IBM
  • Global Foundries, Inc.

External person

Rehan Younas

  • University of Notre Dame
  • University of Notre Dame

External person

D. A. Dipaola

  • IBM
  • IBM Research

External person

Patrick W. Dehaven

  • IBM
  • IBM Research

External person

Anusha Kamath Manjeshwar

  • University of Minnesota
  • University of Minnesota

External person

He Tian

  • University of Southern California

External person

F. Roozeboom

  • NXP Semiconductors

External person

M. Thomas

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering

External person

Theodore M. Lyszczarz

  • Massachusetts Institute of Technology

External person

Qiuwen Lou

  • University of Notre Dame
  • Department of Computer Science and Engineering
  • University of Notre Dame

External person

Avijit Barik

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Fengnian Xia

  • Yale University
  • IBM
  • Department of Electrical Engineering
  • Yale University

External person

H. Shao

  • University of Minnesota

External person

R. Anderson

  • Global Foundries, Inc.

External person

P. M. Asbeck

  • University of California at San Diego
  • Department of Electrical Engineering

External person

R. R. Yu

  • IBM Research

External person

G. Walker

  • Microelectronics Division
  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

S. Zaima

  • Nagoya University

External person

Matthew E. Grein

  • Massachusetts Institute of Technology

External person

Xiaodong Xu

  • University of Washington
  • Department of Physics
  • University of Washington

External person

J. A. Hagan

  • IBM Research

External person

Mark Bowden

  • Pacific Northwest National Laboratory

External person

Jing Li

  • University of Minnesota

External person

K. A. Kelly

  • IBM Research

External person

Yao Zhang

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Michael S. Wiederoder

  • U.S. Army Combat Capabilities Development Command Soldier Center

External person

F. Liu

  • IBM Research
  • University of Minnesota

External person

V. Ongun Özçelik

  • Princeton University
  • Andlinger Center for Energy and the Environment

External person

Y. Zhang

  • ASM America
  • ASM International NV

External person

Azad Naeemi

  • Georgia Institute of Technology

External person

Steven J. Spector

  • Massachusetts Institute of Technology

External person

J. K. Kawasaki

  • University of California at Santa Barbara
  • Department of Materials
  • University of Wisconsin
  • University of California
  • Department of Chemical and Biological Engineering, University of Wisconsin-Madison

External person

Stanley D. Phillips

  • Georgia Institute of Technology

External person

Jean Michel Hartmann

  • University of Minnesota

External person

A. M. Young

  • IBM Research

External person

Michael W. Geis

  • Massachusetts Institute of Technology

External person

M. Cobb

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

Scott A. Chambers

  • Pacific Northwest National Laboratory

External person

Donald R. Wall

  • Global Foundries, Inc.

External person

Peide D. Ye

  • Purdue University

External person

Leonid A. Bendersky

  • National Institute of Standards and Technology
  • Materials Science and Engineering Division
  • Theiss Research

External person

Ce Yang

  • Peking University
  • Department of Materials Science and Engineering

External person

L. Shi

  • IBM Research

External person

Ryan M. Diestelhorst

  • Georgia Institute of Technology
  • IEEE

External person

M. Öztürk

  • North Carolina State University

External person

Georges Pavlidis

  • University of Connecticut
  • National Institute of Standards and Technology
  • University of Connecticut

External person

Matthias Bauer

  • Paderborn University
  • ASM America
  • Department Chemie
  • ASM International NV

External person

W. M M Kessels

  • Eindhoven University at Technology
  • University of California at Santa Barbara
  • Department of Applied Physics
  • Department of Applied Physics

External person

Sebastian Manzo

  • University of Wisconsin
  • Department of Chemical and Biological Engineering, University of Wisconsin-Madison

External person

J. Devrajan

  • ASM America
  • ASM International NV

External person

Rui Ma

  • University of Minnesota

External person

Anderson Janotti

  • University of California at Santa Barbara
  • Materials Department
  • University of Delaware
  • University of Delaware College of Engineering

External person

D. L. Kwong

  • The University of Texas at Austin
  • Agency for Science, Technology and Research
  • National Yang Ming Chiao Tung University
  • Department of ECE
  • Depart. Electrical and Computer Engineering
  • ECE Depart.
  • Department of Electrical Engineering
  • Dept. of Electrical Engineering
  • University of Texas

External person

Jong Seok Jeong

  • University of Minnesota
  • LG Electronics Inc.
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

P. Fay

  • Midwest Institute for Nanoelectronics Discovery (MIND
  • University of Notre Dame
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering

External person

E. Hu

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering

External person

Lena F. Kourkoutis

  • Kavli Institute at Cornell for Nanoscale Science
  • Cornell University

External person

Ryan J. Wu

  • University of Minnesota

External person

Supriyo Datta

  • Purdue University
  • Network for Computational Nanoelectronics

External person

Albert V. Davydov

  • National Institute of Standards and Technology
  • Materials Science and Engineering Division
  • University of California Los Angeles
  • University of California

External person

Y. Liu

  • Cornell University
  • University of Science and Technology of China
  • The Ohio State University
  • Nankai University
  • Nanjing University
  • IBM
  • Chinese Academy of Sciences
  • York University
  • Beijing University of Chinese Medicine
  • University of Oklahoma
  • Purdue University
  • University of Rochester
  • Southern Methodist University
  • Syracuse University
  • Vanderbilt University
  • Virginia Polytechnic Institute and State University
  • California Institute of Technology
  • University of California at San Diego
  • University of California at Santa Barbara
  • University of Colorado Boulder
  • University of Florida
  • Harvard University
  • University of Illinois at Urbana-Champaign
  • Carleton University
  • Natural Sciences and Engineering Research Council
  • McGill University
  • Ithaca College
  • University of Kansas
  • University of Minnesota
  • SUNY Albany
  • Department of Modern Physics
  • Department of Modern Physics
  • Department of Physics
  • Institute of HEP
  • School of Chinese Pharmacy
  • University for Science and Technology of China
  • National Taiwan University
  • Natural Sciences and Engineering Research Council
  • CERN
  • Carnegie Mellon University

External person

Jiadong Zhou

  • Nanyang Technological University

External person

Jongyeon Kim

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Ivan Roth

  • University of Minnesota
  • University of Minnesota

External person

D. Paul

  • University of Cambridge

External person

Y. C. Yeo

  • National University of Singapore
  • Agency for Science, Technology and Research
  • University of Minnesota
  • Electrical and Computer Engineering
  • Silicon Nana Device Lab (SNDL)
  • Department of Electrical Engineering
  • Silicon Nano Device Laboratory
  • Silicon Nana Device Laboratory (SNDL) Electrical and Computer Engineering (ECE) Department
  • Silicon Nano Device Lab (SNDL)

External person

Daniel A. Mohr

  • Bethel University
  • University of Minnesota
  • Physics Department
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

James G. Champlain

  • Naval Research Laboratory
  • Electronics Science and Technology Division

External person

Xiaoxin Wang

  • Dartmouth College

External person

Yao Zhang

  • Institute of High Energy Physics - CAS
  • Peking University

External person

E. X. Zhang

  • Vanderbilt University
  • Electrical Engineering and Computer Science Department

External person

Tao Sun

  • University of Illinois at Urbana-Champaign

External person

Anthony J. Hoffman

  • University of Notre Dame
  • University of Notre Dame

External person

S. T. Pantelides

  • Vanderbilt University
  • Oak Ridge National Laboratory
  • Department of Physics and Astronomy
  • Electrical Engineering and Computer Science Department
  • Department of Electrical Engineering and Computer Science
  • Materials Science and Technology Division
  • Department of Physics and Astronomy
  • Department of Physics

External person

Pulickel M. Ajayan

  • Rice University

External person

Xiaojia Jin

  • Massachusetts Institute of Technology
  • Massachusetts Institute of Technology, Department of Mechanical Engineering

External person

K. A. Jenkins

  • IBM Research
  • IBM
  • Space and Naval Warfare Systems Center

External person

Khaled M. Youssef

  • Qatar University
  • Materials Science and Technology Master Program

External person

E. C. Jones

  • IBM
  • IBM Semiconduct. Res./Devmt. Center

External person

Tao Ma

  • University of Michigan
  • Univ. of Michigan

External person

Rajan Arora

  • Vanderbilt University

External person

M. Givens

  • ASM America
  • LSI Logic Corporation
  • ASM International NV

External person

Roland Kawakami

  • The Ohio State University

External person

Raia C. Finc

  • Boston Scientific

External person

Malcolm Carroll

  • University of Minnesota

External person

David Bugallo

  • Drexel University
  • University of Santiago de Compostela
  • Drexel University College of Engineering

External person

Milan Palei

  • University of Notre Dame
  • University of Notre Dame

External person

Boxin Tang

  • University of Minnesota
  • Department of Chemical Engineering and Materials Science
  • University of Minnesota

External person

Laura E. Simms

  • University of Michigan
  • Augsburg University

External person

Young Hee Lee

  • Institute for Basic Science
  • Sungkyunkwan University

External person

Drew Guckenberger

  • Cornell University
  • Cornell Broadband Commun. Res. Lab.

External person

F. M. Peeters

  • University of Antwerp
  • Universidade Federal do Ceara
  • Physics Department
  • Departamento de Física
  • Department of Physics
  • Departement Fysica

External person

K. H. Wong

  • IBM Research

External person

K. Li

  • Vanderbilt University
  • Electrical Engineering and Computer Science Department

External person

A. L. Sternberg

  • Vanderbilt University
  • Electrical Engineering and Computer Science Department

External person

Chinmoy Nath Saha

  • SUNY Buffalo
  • University at Buffalo

External person

Stephen R. Forrest

  • Princeton University
  • University of Michigan
  • Massachusetts Institute of Technology
  • Materials Science and Engineering
  • Departments of Electrical Engineering and Computer Science
  • Dept. of Electrical Engineering
  • Department of Electrical Engineering
  • Princeton Institute for the Science and Technology of Materials (PRISM)
  • Department of EECS
  • Center for Photonics and Optoelectronic Materials (POEM)
  • Center for POEM
  • Department of Materials Science and Engineering
  • Physical Review Applied
  • Princeton University
  • Univ. of Michigan

External person

Xiaobo Sharon Hu

  • University of Notre Dame
  • Notre Dame University
  • Department of Computer Science and Engineering
  • University of Notre Dame

External person

Yujun Xie

  • Yale University
  • Department of Mechanical Engineering and Materials Science

External person