1990 …2024

Research activity per year

Network

Jiang Hu

  • Texas A&M University
  • IBM
  • Qualcomm Incorporated
  • University of Minnesota
  • Iowa State University
  • Global Foundries, Inc.
  • Department of EE
  • Electrical Engineering Department
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department ol Electrical and Computer Engineering
  • Department of Computer Science and Engineering
  • Texas AandM Univ., Coll. Stn., T.
  • Texas AM University
  • Texas AM University
  • Texas AM University
  • Texas A&M University
  • University of Minnesota Twin Cities
  • University of Minnesota
  • Texas A and M University

External person

Zhengyang Zhao

  • University of Minnesota
  • School of Electrical and Computer Engineering
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Charles J. Alpert

  • IBM
  • University of Minnesota
  • IEEE
  • University of Minnesota Twin Cities

External person

Vivek Mishra

  • University of Minnesota
  • Synopsys Inc.
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Haifeng Qian

  • IBM Research
  • IBM
  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota
  • TIBM Research

External person

Steven M. Burns

  • Intel
  • University of Minnesota

External person

Min Zhao

  • University of Michigan
  • Motorola
  • University of Minnesota
  • Elec. Eng. and Comp. Sci. Dept.

External person

Palkesh Jain

  • Product and Test Engineering Group
  • Qualcomm Technologies Inc.
  • Qualcomm India
  • Texas Instruments
  • Qualcomm India Pvt. Ltd.
  • Customer Enablement Group
  • Qualcomm India
  • Qualcomm Technologies Inc
  • University of Minnesota
  • Product and Test Engineering Group
  • Qualcomm Technologies Inc.

External person

Yaguang Li

  • Texas A&M University
  • Texas AM University
  • Texas AM University
  • University of Minnesota
  • Texas AM University
  • Texas A&M University
  • Texas A and M University

External person

Yong Zhan

  • Cadence Design Systems
  • University of Minnesota
  • University of Minnesota

External person

Wenbin Xu

  • Texas A&M University
  • Department of Electrical and Computer Engineering
  • Texas AandM Univ., Coll. Stn., T.
  • Texas AM University
  • Texas AM University
  • Texas A and M University

External person

Deepashree Sengupta

  • University of Minnesota
  • University of Minnesota

External person

Andrew B. Kahng

  • University of California at San Diego
  • IBM
  • CSE Department
  • Department of Electrical and Computer Engineering
  • Department of Computer Science & Engineering
  • ECE Departments
  • UC San Diego
  • UCLA CS Dept.
  • University of California Los Angeles
  • University of California

External person

Pingqiang Zhou

  • University of Minnesota
  • University of Minnesota Twin Cities

External person

Gracieli Posser

  • Universidade Federal do Rio Grande do Sul
  • Instituto de Informática - PPGC/PGMicro

External person

Ricardo Reis

  • Universidade Federal do Rio Grande do Sul
  • Instituto de Informática - PPGC/PGMicro

External person

Soner Yaldiz

  • Intel
  • Carnegie Mellon University
  • University of Minnesota

External person

Yishuang Lin

  • Texas A&M University
  • Texas AM University
  • University of Minnesota
  • Texas A and M University

External person

Brent Goplen

  • University of Minnesota
  • IBM
  • IEEE
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Haihua Su

  • IBM
  • University of Minnesota
  • University of Minnesota

External person

Jaskirat Singh

  • University of Minnesota
  • Intel
  • IEEE
  • Circuit and Layout Technology Group
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Saket Gupta

  • Broadcom Corporation
  • University of Minnesota
  • Broadcom Corporation
  • Development
  • Development
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Jianxin Fang

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Jordi Cortadella

  • Polytechnic University of Catalonia
  • Universitat Politècnica de Catalunya
  • Computer Science Department
  • Computer Science Department

External person

Naresh Maheshwari

  • Iowa State University
  • IEEE
  • Iowa State University

External person

Tianpei Zhang

  • Cadence Design Systems
  • University of Minnesota
  • University of Minnesota Twin Cities

External person

Parijat Mukherjee

  • Intel
  • University of Minnesota

External person

S. K. Karandikar

  • Tata Institute of Social Sciences
  • IBM
  • University of Minnesota
  • Department of Electrical Engineering
  • University of Minnesota

External person

S. Karen Khatamifard

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Sanjay V. Kumar

  • University of Minnesota

External person

Rupesh S. Shelar

  • Intel
  • University of Minnesota
  • IEEE
  • Desktop Products Group
  • Microprocessor Group
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Zhaoxin Liang

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Sravan K. Marella

  • University of Minnesota
  • Logic Technology Development
  • Intelc Corporation
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Vidyasagar Nookala

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Yanbin Jiang

  • Sogang University
  • Iowa State University
  • Cadence Design Systems
  • IEEE

External person

Stephen T. Quay

  • IBM
  • University of Minnesota
  • Global Foundries, Inc.

External person

Haitian Hu

  • Motorola
  • University of Minnesota
  • University of Minnesota

External person

Rajendran Panda

  • University of Michigan
  • Motorola
  • Elec. Eng. and Comp. Sci. Dept.

External person

Pravin M. Vaidya

  • University of Illinois at Urbana-Champaign
  • Iowa State University
  • Department of Computer Science
  • University of Illinois

External person

Cyrus Bamji

  • Sogang University
  • Iowa State University
  • Cadence Design Systems
  • Canesta Inc.
  • IEEE

External person

Prashant Saxena

  • Synopsys Inc.
  • Intel
  • Advanced Technology Group

External person

Yaoguang Wei

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Kaushik Gala

  • University of Michigan
  • Motorola
  • University of Minnesota
  • Elec. Eng. and Comp. Sci. Dept.
  • Advanced Tools Group
  • University of Minnesota

External person

Hongliang Chang

  • Cadence Design Systems
  • IEEE
  • University of Minnesota
  • Dept. of Comp. Sci. and Engineering
  • Department of Computer Science and Engineering
  • University of Minnesota

External person

Sung Mo Kang

  • University of Illinois at Urbana-Champaign
  • University of California at Santa Cruz
  • Iowa State University
  • Department of Electrical and Computer Engineering
  • University of Illinois

External person

Sanjay V. Kumar

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

John Keane

  • Intel
  • Intel
  • University of Tokyo
  • University of Minnesota
  • IEEE
  • Portland Technology Development
  • Advanced Design
  • Technology and Manufacturing Group
  • Nnanya-Nakamura Laboratory
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Ayan Paul

  • University of Minnesota
  • Qualcomm Incorporated
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Cliff Sze

  • IBM
  • Texas A&M University
  • Texas A and M University

External person

Ping Hung Yuh

  • National Taiwan University
  • Department of Computer Science and Information Engineering
  • Computer Science and Information Engineering Department
  • Dept. Computer Science and Information Engineering
  • Department of Computer Science and Information Engineering
  • National Taiwan University

External person

David T. Blaauw

  • University of Michigan
  • Motorola
  • Elec. Eng. and Comp. Sci. Dept.
  • Department of Electrical Engineering and Computer Science
  • Department of EECS
  • Department of Electrical Engineering and Computer Science
  • Univ. of Michigan

External person

Lin Huang

  • Department of Electrical and Computer Engineering
  • Texas A&M University
  • Texas A and M University

External person

Baktash Boghrati

  • University of Minnesota

External person

Gu Jie

  • Texas Instruments
  • MaxLinear Incorporated
  • University of Tokyo
  • University of Minnesota
  • IEEE
  • Nnanya-Nakamura Laboratory
  • Northwestern University
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Vijay Sundararajan

  • Texas Instruments
  • Royal Institute of Technology
  • Technical University of Crete
  • University of Minnesota
  • IEEE
  • Wireless Infrastructure Branch
  • University of Minnesota Twin Cities

External person

Weitong Chuang

  • University of Illinois at Urbana-Champaign
  • Alcatel-Lucent
  • Iowa State University
  • University of Minnesota
  • Macronix Semiconductor Company

External person

Qunzeng Liu

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Hushrav D. Mogal

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Kaushik Roy

  • Purdue University
  • University of Minnesota
  • Department of Electrical and Computer Engineering
  • Sch. of Elec./Computer Engineering
  • Department of Electrical Engineering
  • School of ECE
  • School of Electrical and Computer Engineering

External person

André I. Reis

  • Universidade Federal do Rio Grande do Sul
  • Nangate Inc.
  • University of Minnesota
  • Grupo de Banco de Dados Intellgentes
  • Programa de Pós-Graduação em Microeletrônica
  • University of Minnesota Twin Cities

External person

Gopal Gandham

  • IBM
  • University of Minnesota
  • IBM EDA Lab
  • Global Foundries, Inc.

External person

Dennis Sylvester

  • University of Michigan
  • Eta Kappa Nu
  • IEEE
  • ACM
  • American Society for Engineering Education
  • Department of Electrical Engineering and Computer Science
  • Department of EECS
  • Department of Electrical Engineering
  • Elec. Eng. and Comp. Sci. Dept.
  • University of Michigan Health Systems
  • University of California
  • Synopsys Inc.
  • UCLA CS Dept.
  • Univ. of Michigan

External person

T. A. Peterson

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Nestor Evmorfopoulos

  • University of Thessaly

External person

Mahesh Ketkar

  • University of Minnesota
  • University of Minnesota

External person

Chaofan Li

  • Texas A&M University
  • Department of Electrical and Computer Engineering
  • Texas AandM Univ., Coll. Stn., T.

External person

Renato P. Ribas

  • Universidade Federal do Rio Grande do Sul
  • Grupo de Banco de Dados Intellgentes
  • Programa de Pós-Graduação em Microeletrônica

External person

Desmond A. Kirkpatrick

  • Texas A&M University
  • Intel

External person

Piyush K. Sancheti

  • Iowa State University
  • Cadence Design Systems
  • Iowa State University

External person

Yao Wen Chang

  • National Taiwan University
  • Department of Electrical Engineering
  • Graduate Institute of Electronics Engineering
  • Department of Electrical Engineering
  • Physics Department
  • Middle East Technical University
  • CERN
  • Cukurova University
  • University of Zurich
  • Chulalongkorn University
  • Boston University
  • University of Belgrade
  • Izmir Institute of Technology
  • National Central University
  • National Taiwan University

External person

Felipe S. Marques

  • Grupo de Banco de Dados Intellgentes
  • Universidade Federal do Rio Grande do Sul

External person

Jose L. Neves

  • IBM
  • University of Minnesota
  • IBM EDA Lab
  • Global Foundries, Inc.

External person

Hadi Esmaeilzadeh

  • Georgia Institute of Technology
  • University of California at San Diego

External person

Zhiang Wang

  • University of California at San Diego
  • University of California SanDiego

External person

Xinning Wang

  • Intel
  • Strategic CAD Labs.

External person

Soroush Ghodrati

  • University of California at San Diego

External person

I. Hong Hou

  • Department of Electrical and Computer Engineering
  • Texas A&M University
  • Texas A and M University

External person

Jieming Yin

  • University of Minnesota
  • Department of Computer Science and Engineering
  • Lehigh University
  • University of Minnesota Twin Cities
  • University of Minnesota
  • Lehigh University

External person

Sean Kinzer

  • University of California at San Diego

External person

Pingqiang Zhou

  • Shanghai Tech University
  • ShanghaiTech University
  • School of Information Science and Technology
  • ShanghaiTech University
  • University of Minnesota Twin Cities
  • University of Minnesota
  • University of Minnesota

External person

Huibo Hou

  • Iowa State University
  • Qualcomm Incorporated
  • University of Minnesota
  • Department ol Electrical and Computer Engineering
  • University of Minnesota

External person

Anup Kumar Sultania

  • Calypto Design System Inc.
  • University of Minnesota
  • Calypto Design Systems
  • University of Minnesota

External person

Vasant B. Rao

  • University of Illinois at Urbana-Champaign
  • IBM
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

Rahul B. Deokar

  • Iowa State University
  • Tnwa State TTnivercitv

External person

Chia Lin Yang

  • National Taiwan University
  • Department of Computer Science and Information Engineering
  • Dept. Computer Science and Information Engineering
  • Department of Computer Science and Information Engineering
  • National Taiwan University

External person

Juho Kim

  • Cadence Design Systems
  • IEEE
  • Sogang University
  • Iowa State University

External person

Xiaobo Sharon Hu

  • University of Notre Dame
  • Notre Dame University
  • Department of Computer Science and Engineering
  • University of Notre Dame

External person

Meisam Razaviyayn

  • Stanford University
  • University of Minnesota
  • University of Southern California
  • Electrical Engineering Department
  • Daniel J. Epstein Department of Industrial and Systems Engineering
  • Department of Electrical and Computer Engineering
  • Dept. of Elect. and Compt. Eng.
  • Dept. of Elect. Eng.
  • Department of Industrial and Systems Engineering
  • University of Minnesota Twin Cities
  • University of Minnesota
  • Stanford University
  • University of Southern California

External person

Joon Kyung Kim

  • University of California at San Diego

External person

Michael Niemier

  • University of Notre Dame
  • Notre Dame University
  • Department of Computer Science and Engineering
  • University of Notre Dame

External person

John Lillis

  • University of Illinois Chicago
  • IBM
  • Electrical Engineering and Computer Science Department
  • University of Illinois at Chicago

External person

John P. Fishburn

  • Mentor Graphics Corporation
  • Iowa State University

External person

Tae Hyoung Kim

  • Nanyang Technological University
  • University of Minnesota
  • IEEE
  • IBM
  • School of Electrical and Electronic Engineering
  • School of EEE
  • School of Electrical and Electronic Engineering
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Minsoo Kim

  • University of California at San Diego
  • University of Minnesota

External person

Brandon Del Bel

  • University of Minnesota

External person

Yehea I. Ismail

  • Northwestern University

External person

Alberto Moreno

  • Polytechnic University of Catalonia
  • Computer Science Department

External person

Kishore Kasamsetty

  • University of Minnesota

External person

Uday Mallappa

  • University of California at San Diego

External person

Olympia Axelou

  • University of Thessaly

External person

Martin D F Wong

  • The University of Texas at Austin
  • University of Illinois at Urbana-Champaign
  • IEEE

External person

Anand Raghunathan

  • Purdue University
  • School of Electrical and Computer Engineering

External person

D. C. Mahendra

  • University of Minnesota
  • Department of Physics
  • University of Minnesota Twin Cities

External person

Karthikk Sridharan

  • University of Minnesota
  • University of Minnesota Twin Cities

External person

Martin Kuhlmann

  • Broadcom Corporation
  • Polytechnic University of Valencia
  • University of Minnesota
  • IEEE
  • University of Minnesota

External person

Jatan C. Shah

  • Iowa State University
  • Iowa State University

External person

Rohan Mahapatra

  • University of California at San Diego

External person

Vipul Ahuja

  • Qualcomm Technologies Inc
  • Qualcomm Technologies Inc.

External person

Jatuchai Pangjun

  • University of Minnesota
  • University of Minnesota

External person

Shankar Ramaswamy

  • Transarc Corp
  • University of Illinois at Urbana-Champaign

External person

Harsha Sathyamurthy

  • Mentor Graphics Corporation
  • Iowa State University

External person

Erin Olson

  • University of Minnesota
  • University of Minnesota Twin Cities

External person

Marc Lupon

  • Polytechnic University of Catalonia
  • Computer Science Department

External person

Mike Kishinevsky

  • Intel
  • Strategic CAD Labs.

External person

Sayak Kundu

  • University of California at San Diego

External person

Antoni Roca

  • Polytechnic University of Catalonia
  • Computer Science Department

External person

Hanyong Eom

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Milos Hrkic

  • University of Illinois Chicago
  • IBM
  • Electrical Engineering and Computer Science Department
  • University of Illinois at Chicago

External person

Hao Lo

  • University of Minnesota
  • University of Minnesota

External person

Leomar S. Da Rosa

  • Universidade Federal do Rio Grande do Sul
  • Grupo de Banco de Dados Intellgentes
  • Programa de Pós-Graduação em Microeletrônica

External person

Nikhil Patil

  • Qualcomm Technologies Inc
  • Qualcomm Technologies Inc.

External person

Guoqiang Chen

  • Synopsys Inc.
  • University of Minnesota

External person

Ashwath Prabhu

  • Qualcomm Technologies Inc
  • Qualcomm Technologies Inc.

External person

Robert Perricone

  • University of Notre Dame
  • Department of Computer Science and Engineering
  • University of Notre Dame

External person

Jongyeon Kim

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Prithviraj Banerjee

  • IEEE
  • Northwestern University
  • University of Illinois at Urbana-Champaign
  • Center for Parallel and Distributed Computing

External person

Dong Jiao

  • Samsung
  • Google Inc.
  • University of Minnesota
  • Samsung Advanced Institute of Technology
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Wenjing Jiang

  • University of Minnesota

External person

Ibrahim N. Hajj

  • University of Illinois at Urbana-Champaign
  • Alcatel-Lucent

External person

Bao Liu

  • University of Illinois Chicago
  • IBM
  • Electrical Engineering and Computer Science Department
  • University of Illinois at Chicago

External person

Yan Feng

  • University of Minnesota
  • University of Minnesota

External person

Bangqi Xu

  • University of California at San Diego

External person

Lutong Wang

  • University of California at San Diego

External person

John Moy

  • University of Minnesota
  • University of Minnesota

External person

Tutu Ajayi

  • University of Michigan
  • U. Michigan

External person

Israel Koren

  • University of Massachusetts
  • Department of Electrical and Computer Engineering
  • University of Massachusetts Amherst

External person

Benton Calhoun

  • University of Virginia
  • University of Virginia School of Engineering and Applied Science

External person

Suresh Raman

  • University of Minnesota
  • University of Minnesota Twin Cities

External person

Bin Da Liu

  • University of Minnesota

External person

Abhishek Arun

  • University of Minnesota

External person

Bernard Courtois

  • IEEE
  • ACM
  • Laboratory of Techniques of Informatics and Microelectronics for Computer Architectecture
  • ASME International

External person

Rohan Mahapatra

  • University of California at San Diego

External person

Radu Marculescu

  • Carnegie Mellon University
  • Electrical and Computer Engineering Faculty

External person

Dmitry Bufistov

  • Polytechnic University of Catalonia

External person

Yanqing Zhang

  • University of Virginia
  • NVIDIA

External person

Shiyu Su

  • University of Southern California
  • University of Southern California

External person

Qiaochu Zhang

  • University of Southern California
  • University of Southern California

External person

Mark Po Hung Lin

  • National Yang Ming Chiao Tung University

External person

Jaewon Kim

  • University of Minnesota
  • University of Illinois at Urbana-Champaign

External person

H. Sivaramakrishnan

  • University of Minnesota

External person

Jeng Llang Tsai

  • University of Wisconsin

External person

Ming Dou Ker

  • National Yang Ming Chiao Tung University
  • Department of Electronics Engineering

External person

Lucas De Paris

  • NSCAD Microeletrônica

External person

Steven M. Nowick

  • Columbia University

External person

S. Mukhopadhyay

  • Purdue University
  • Georgia Institute of Technology
  • IBM
  • Sch. of Elec./Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering

External person

William Cho

  • University of Minnesota

External person

Edwin Mascarenhas

  • University of California at San Diego

External person

Qian Haifeng

  • TIBM Research

External person

Shiyan Hu

  • Michigan Technological University
  • Department of Electrical and Computer Engineering
  • Michigan Technological University

External person

Diana Marculescu

  • Carnegie Mellon University
  • Department of Electrical and Computer Engineering
  • Carnegie Mellon University

External person

Bing Yue Wu

  • Arizona State University

External person

Kamyar Mirzazad Barijough

  • The University of Texas at Austin

External person

Jiang Hu

  • University of Minnesota
  • Texas A&M University

External person

Ying Chen

  • San Francisco State University
  • University of Minnesota
  • School of Engineering

External person

Mateus Fogaça

  • PGMicro/UFRGS

External person

Mingjie Liu

  • The University of Texas at Austin

External person

Zhan Yong

  • University of Minnesota

External person

Anup Holey

  • Intel Corporation
  • University of Minnesota
  • Intel
  • Department of Computer Science and Engineering
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Tiago M G Cardoso

  • Universidade Federal do Rio Grande do Sul
  • Grupo de Banco de Dados Intellgentes

External person

Luciano Lavagno

  • Polytechnic University of Turin
  • Department of Electronics

External person

Shiyu Guo

  • Northwestern University

External person

Andrew P. Lyle

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Abdelrahman Hosny

  • Brown University

External person

Pedro Lopez

  • Polytechnic University of Catalonia

External person

Mohamed Shalan

  • American University in Cairo

External person

Mohammad Abdullah Al Shohel

  • University of Minnesota
  • University of Minnesota

External person

Mingyu Woo

  • University of Minnesota

External person

Steve M. Kang

  • Iowa State University

External person

Hanyang Xu

  • University of California at San Diego

External person

Youmeng Li

  • Department of Software Engineering
  • Tianjin University

External person

Jiang Hu

  • Texas A&M University

External person

Ravi Varadarajan

  • University of California at San Diego

External person

George Floros

  • University of Thessaly

External person

C. A. Ross

  • Massachusetts Institute of Technology
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Massachusetts Institute of Technology, Department of Mechanical Engineering

External person

Sumanth Kamineni

  • University of Virginia

External person

William Swartz

  • U. Texas-Dallas
  • University of Texas at Dallas

External person

Pavlos Stoikos

  • University of Thessaly

External person

Keren Zhu

  • The University of Texas at Austin

External person

Jaijeet Roychowdhury

  • University of California
  • University of Minnesota
  • Department of Electrical Engineering and Computer Sciences

External person

Marina Neseem

  • Brown U.
  • Brown University

External person

Chetan Choppali Sudarshan

  • Arizona State University

External person

Callan Carpenter

  • Silicon Metrics in Austin

External person

Abhimanyu Kumar

  • University of Minnesota

External person

Jian Ping Wang

  • University of Minnesota

External person

Jonathan Harms

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Krishnendu Chakrabarty

  • Sigma Xi
  • ACM
  • Duke University
  • SIGDA

External person

Srimat T. Chakradhar

  • NEC Laboratories America, Inc.

External person

Borivoje Nikolić

  • University of California

External person

Samuel Saunders

  • University of Southern California
  • University of Southern California

External person

Marwan M. Hassoun

  • Iowa State University
  • Iowa State University

External person

Daksh Lehther

  • Iowa State University

External person

Brahmendra Reddy Yatham

  • University of California at San Diego

External person

X. Sharon Hu

  • University of Notre Dame
  • Department of Computer Science and Engineering

External person

Sabita Pilli

  • Iowa State University

External person

Ying Chen

  • IEEE
  • University of Minnesota
  • University of Minnesota

External person

F. R. Schneider

  • Universidade Federal do Rio Grande do Sul
  • Grupo de Banco de Dados Intellgentes

External person

Weiping Shi

  • Texas A&M University
  • Department of Electrical and Computer Engineering

External person

Vishwani D. Agrawal

  • ACM
  • Rutgers - The State University of New Jersey
  • RADICAL Laboratory
  • Department of Electrical and Computer Engineering

External person

Vijaykrishnan Narayanan

  • Pennsylvania State University Hershey
  • Department of Computer Science and Engineering
  • Pennsylvania State University

External person

Ranga Vemuri

  • University of Cincinnati
  • Laboratory for Digital Design Environments

External person

Zhehong Wang

  • University of Michigan

External person

Inhak Han

  • Korea Advanced Institute of Science and Technology
  • Department of Electrical Engineering

External person

Lizy K. John

  • The University of Texas at Austin
  • UT Austin Engineering Foundation
  • Univerity of Texas (UT)
  • Department of ECE
  • Electrical and Computer Engineering Department
  • University of Texas

External person

Ramesh Hajiani

  • University of Minnesota

External person

Juzheng Liu

  • University of Southern California
  • University of Southern California

External person

Bongjin Kim

  • University of Minnesota
  • Rambus Inc.
  • Rambus
  • Stanford University
  • Nanyang Technological University
  • Department of Electrical and Electronic Engineering
  • Rambus Inc.
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Youngsoo Shin

  • Korea Advanced Institute of Science and Technology
  • Department of Electrical Engineering

External person

Sarma Vrudhula

  • Arizona State University
  • Synopsys Inc.
  • Peking University
  • Arizona State University

External person

Frank Liu

  • IBM
  • IBM
  • Oak Ridge National Laboratory
  • IBM Research

External person

Zhang Tianpei

  • University of Minnesota

External person

Mohsen Hassanpourghadi

  • University of Southern California
  • University of Southern California

External person

Kevin Nowka

  • IBM
  • IBM Austin Research Laboratory

External person

Chaitanya Kshirsagar

  • University of Minnesota
  • University of Minnesota

External person

Donghao Fang

  • Texas A&M University

External person

Faysal Sohail

  • Synopsys Inc.

External person

Won Ho Choi

  • University of Minnesota
  • Western Digital
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Amit Ranjan Trivedi

  • Georgia Institute of Technology
  • School of Electrical and Computer Engineering

External person

Shray Jain

  • University of Minnesota
  • School of Electrical and Computer Engineering
  • Purdue University

External person

Azad Naeemi

  • Georgia Institute of Technology

External person

Krishnendu Chakrabarty

  • Duke University
  • ACM
  • SIGDA

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Nikhil Matkar

  • Arizona State University

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Shiyu Guo

  • Northwestern University

External person

N. Kumaraguruparan

  • University of Minnesota

External person

Jiaxi Hu

  • University of Minnesota
  • Apple
  • Department of Electrical and Computer Engineering
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Wei Luo

  • Texas A&M University
  • Department of Electrical and Computer Engineering
  • Texas AandM Univ., Coll. Stn., T.

External person

Hanzhao Yu

  • University of Minnesota
  • University of Minnesota

External person

Nagarajan Ranganathan

  • IEEE
  • University of South Florida
  • Department of Computer Science and Engineering
  • University of South Florida

External person

Angeline K. Smith

  • University of Minnesota
  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Mike Shuo Wei Chen

  • University of Southern California
  • University of Southern California

External person

Anthony Levi

  • University of Southern California

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Charlie Chung Ping Chen

  • National Taiwan University
  • IEEE

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Arvind Vinod

  • University of Minnesota

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Jeongsup Lee

  • University of Michigan

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Tejaswini Kolpe

  • University of Minnesota
  • University of Minnesota

External person

Sherief Reda

  • Brown U.
  • Brown University
  • School of Engineering

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Niraj K. Jha

  • Association for Computing Machinery
  • Princeton University
  • Association for Computing Machinery
  • Princeton University

External person

Rajeev Murgal

  • Zenasis Technologies in Campbell

External person

Cristinel Ababei

  • Magma Design Automation Inc.
  • University of Minnesota
  • University of Minnesota Twin Cities
  • Marquette University
  • Marquette University
  • University of Minnesota

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Matt Amrein

  • Milwaukee School of Engineering

External person

Supriyo Datta

  • Purdue University
  • Network for Computational Nanoelectronics

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George Stamoulis

  • University of Thessaly

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Liu Qunzeng

  • University of Minnesota

External person

Liang Zhaoxin

  • University of Minnesota
  • University of Minnesota Twin Cities

External person

Soheil Hashemi

  • Brown U.
  • Brown University
  • School of Engineering

External person

Jaeha Kung

  • Korea Advanced Institute of Science and Technology
  • Department of Electrical Engineering

External person

Ronald DeMara

  • SEECS
  • University of Central Florida
  • Department of Electrical and Computer Engineering
  • Computer Engineering Program
  • University of Central Florida

External person

Jian Ping Wang

  • University of Minnesota
  • University of Minnesota Twin Cities

External person

Paul McLellan

  • Cadence Design Systems

External person

Roland Kawakami

  • The Ohio State University

External person

Rezwan Rasul

  • University of Southern California
  • University of Southern California

External person

Mehdi Saligane

  • University of Michigan
  • U. Michigan

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Geraldo Pradipta

  • University of Minnesota

External person

Mahendra Dc

  • University of Minnesota
  • Stanford University
  • Intel
  • University of Minnesota Twin Cities
  • University of Minnesota
  • Stanford University

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Andreas Gerstlauer

  • The University of Texas at Austin

External person

Jie Gu

  • Northwestern University

External person

Hao Chen

  • The University of Texas at Austin

External person

Venkatesan Rajappan

  • Synplicity Inc.

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Sandeep Gupta

  • University of Southern California
  • University of Southern California

External person

David Z. Pan

  • The University of Texas at Austin

External person

Ahmed A. Younis

  • Iowa State University
  • Iowa State University

External person

Carl Sechen

  • U. Texas-Dallas
  • University of Texas at Dallas

External person

C. L. Chien

  • Johns Hopkins University
  • Nanyang Technological University

External person