Projects per year
Fingerprint The Fingerprint is created by mining the titles and abstracts of the person's research outputs and projects/funding awards to create an index of weighted terms from discipline-specific thesauri.
- 3 Similar Profiles
Specifications
Engineering & Materials Science
Testing
Engineering & Materials Science
Model checking
Engineering & Materials Science
Avionics
Engineering & Materials Science
Specification languages
Engineering & Materials Science
Software engineering
Engineering & Materials Science
Formal methods
Engineering & Materials Science
Computer systems
Engineering & Materials Science
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Projects 2004 2020
Planning IUCRC University of Minnesota: Center for High-Assurance Secure Systems and IoT (CHASSI)
Heimdahl, M., Hopper, N., Lu, K., McCamant, S. A. & Rayadurgam, S.
10/1/19 → 9/30/20
Project: Research project
Planning
Internet of things
SHF: Medium: Contract-Based Black-Box Assurance
Heimdahl, M., McCamant, S. A. & Rayadurgam, S.
6/15/16 → 5/31/20
Project: Research project
Contracts
Architectural Modeling and Analysis for Safety Engineeri
Heimdahl, M., Heimdahl, M. & Whalen, M. W.
12/20/16 → 9/30/19
Project: Research project
Safety engineering
contract research
student
Binary Transformation and Contract Discovery
Heimdahl, M., McCamant, S. A., Rayadurgam, S. & Whalen, M. W.
5/8/15 → 5/9/16
Project: Research project
Research Output 1991 2019
Requirements reference models revisited: Accommodating hierarchy in system design
Murugesan, A., Rayadurgam, S. & Heimdahl, M., Sep 2019, Proceedings - 2019 IEEE 27th International Requirements Engineering Conference, RE 2019. Damian, D., Perini, A. & Lee, S-W. (eds.). IEEE Computer Society, p. 177-186 10 p. 8920675. (Proceedings of the IEEE International Conference on Requirements Engineering; vol. 2019-September).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Systems analysis
Requirements engineering
System design
Reference model
Pumps
Contract discovery from black-box components
Sharma, V., Byun, T., McCamant, S. A., Rayadurgam, S. & Heimdahl, M., Nov 9 2018, WASPI 2018 - Proceedings of the 1st ACM SIGSOFT International Workshop on Automated Specification Inference, Co-located with FSE 2018. Honavar, V., Nguyen, T. N., Leavens, G. T., Dyer, R., Rajan, H. & Nguyen, H. A. (eds.). Association for Computing Machinery, Inc, p. 5-8 4 p. (WASPI 2018 - Proceedings of the 1st ACM SIGSOFT International Workshop on Automated Specification Inference, Co-located with FSE 2018).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Static analysis
Dynamic analysis
Systems analysis
6
Citations
(Scopus)
Architectural modeling and analysis for safety engineering
Stewart, D., Whalen, M. W., Cofer, D. & Heimdahl, M. P. E., Jan 1 2017, Model-Based Safety and Assessment - 5th International Symposium, IMBSA 2017, Proceedings. Bozzano, M. & Papadopoulos, Y. (eds.). Springer- Verlag, p. 97-111 15 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); vol. 10437 LNCS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Safety engineering
Security systems
Safety
Engineering
Braking
2
Citations
(Scopus)
Automated Steering of Model-Based Test Oracles to Admit Real Program Behaviors
Gay, G., Rayadurgam, S. & Heimdahl, M. P. E., Jun 1 2017, In : IEEE Transactions on Software Engineering. 43, 6, p. 531-555 25 p.Research output: Contribution to journal › Article
Testing
Acceptance tests
Real time systems
Embedded systems
Sensors
1
Citation
(Scopus)
Discovering instructions for robust binary-level coverage criteria
Sharma, V., Byun, T., McCamant, S., Rayadurgam, S. & Heimdahl, M. P. E., Jul 13 2017, TECPS 2017 - Proceedings of the 1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems, co-located with ISSTA 2017. Yu, T. & Marinov, D. (eds.). Association for Computing Machinery, Inc, p. 1-4 4 p. (TECPS 2017 - Proceedings of the 1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems, co-located with ISSTA 2017).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
coverage
instruction
ability