Network

R. F. Richards

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Mechanical and Materials Engineering
  • Washington State University

External person

C. D. Richards

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Mechanical and Materials Engineering
  • Washington State University

External person

D. F. Bahr

  • Washington State University
  • University of Minnesota
  • School of Mechanical and Materials Engineering
  • Mechanical and Materials Engineering
  • Dept. of Chem. Eng. and Mat. Sci.
  • Dept. of Mechanical/Mat. Eng.
  • Washington State University

External person

David H. Gracias

  • Johns Hopkins University
  • Massachusetts Institute of Technology
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemistry
  • Department of Materials Science and Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Johns Hopkins University

External person

S. Tom Picraux

  • Los Alamos National Laboratory
  • Center for Integrated Nanotechnologies
  • Center for Integrated Nanotechnologies

External person

M. J. Anderson

  • University of Idaho
  • University of Minnesota
  • Milwaukee School of Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering

External person

Chao Liu

  • University of Minnesota

External person

Hong Chen

  • Xi'an Polytechnic University

External person

Chao Liu

  • University of Minnesota

External person

Lianbi Li

  • Xi'an Polytechnic University
  • University of Minnesota

External person

Yuan Zang

  • Xi'an University of Technology

External person

John Cumings

  • University of Maryland
  • Department of Material Science and Engineering
  • Department of Materials Science and Engineering

External person

J. Jiao

  • Portland State University
  • Department of Physics

External person

Caijuan Xia

  • Xi'an Polytechnic University

External person

Jian Yu Huang

  • Sandia National Laboratories NM
  • Massachusetts Institute of Technology
  • Center for Integrated Nanotechnologies

External person

Daniel Wratkowski

  • University of Minnesota

External person

John P. Sullivan

  • Sandia National Laboratories NM
  • Center for Integrated Nanotechnologies

External person

Xiao Hua Liu

  • Sandia National Laboratories NM
  • Agency for Science, Technology and Research
  • Center for Integrated Nanotechnologies

External person

Qianqian Lei

  • Xi'an Polytechnic University

External person

Shadi A. Dayeh

  • Los Alamos National Laboratory
  • Center for Integrated Nanotechnologies
  • Center for Integrated Nanotechnologies

External person

P. D. Hayenga

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Mechanical and Materials Engineering
  • Washington State University

External person

Teena James

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Johns Hopkins University

External person

Li Zhong

  • University of Pittsburgh
  • Department of Mechanical Engineering and Materials Science
  • University of Pittsburgh

External person

D. J. Morris

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Washington State University

External person

Yongkang Xu

  • Xi'an Polytechnic University

External person

J. Jiao

  • Portland State University

External person

Jichao Hu

  • Xi'an University of Technology

External person

Chunsheng Wang

  • University of Maryland
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering

External person

He Zheng

  • Wuhan University
  • University of Pittsburgh
  • Department of Mechanical Engineering and Materials Science
  • Department of Physics
  • MOE Key Laboratory of Artificial Micro- and Nanostructures
  • University of Pittsburgh

External person

Jeongmin Ahn

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Washington State University

External person

Eric Epstein

  • University of Maryland
  • Department of Material Science and Engineering
  • Department of Materials Science and Engineering

External person

Zebin Li

  • Xi'an Polytechnic University

External person

Noy Bassik

  • Johns Hopkins University
  • Neuropathology Laboratory
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Johns Hopkins University

External person

R. Johnson

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Washington State University

External person

M. C. Robinson

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Mechanical and Materials Engineering
  • Washington State University

External person

Xianglong Li

  • Los Alamos National Laboratory
  • Center for Integrated Nanotechnologies
  • Center for Integrated Nanotechnologies

External person

Khim Karki

  • University of Maryland
  • Department of Material Science and Engineering
  • Department of Materials Science and Engineering

External person

A. Hamdan

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Washington State University

External person

Scott X. Mao

  • University of Pittsburgh
  • Department of Mechanical Engineering and Materials Science
  • University of Pittsburgh

External person

Zhi Zhen Ye

  • Zhejiang University
  • State Key Laboratory of Silicon Materials

External person

S. Hu

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Johns Hopkins University

External person

Jiang Wei Wang

  • University of Pittsburgh
  • Department of Mechanical Engineering and Materials Science

External person

Yang Liu

  • Sandia National Laboratories NM
  • Center for Integrated Nanotechnologies

External person

Li Qiang Zhang

  • University of Pittsburgh
  • Zhejiang University
  • Department of Mechanical Engineering and Materials Science
  • State Key Laboratory of Silicon Materials

External person

Dibakar Roy Chowdhury

  • Mahindra Ecole Centrale

External person

Chien Shung Lin

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Washington State University

External person

Yuping Zhang

  • Los Alamos National Laboratory

External person

Seokhyeong Lee

  • University of Minnesota

External person

L. W. Weiss

  • Washington State University
  • School of Mechanical and Materials Engineering

External person

Abul K. Azad

  • Los Alamos National Laboratory
  • Division of Materials Physics and Applications

External person

Si Young Park

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Johns Hopkins University

External person

Joseph Schauff

  • University of Minnesota

External person

L. W. Weiss

  • Washington State University

External person

Zheng Jia

  • University of Maryland
  • Department of Mechanical Engineering

External person

Ting Zhu

  • Georgia Institute of Technology

External person

Hye Rin Kwag

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering
  • Johns Hopkins University

External person

V. B. Shenoy

  • Brown University
  • Division of Engineering
  • School of Engineering
  • Division of Engineering
  • University of Pennsylvania
  • Brown University

External person

Jing Li

  • University of Minnesota

External person

N. Li

  • Los Alamos National Laboratory
  • Center for Integrated Nanotechnologies
  • Division of Materials Physics and Applications
  • Institute for Materials Science
  • Center for Integrated Nanotechnologies
  • Institute for Materials Science and Center for Integrated Nanotechnologies
  • Center for Integrated Nanotechnologies

External person

Christina L. Randall

  • Johns Hopkins University
  • Neuropathology Laboratory
  • Johns Hopkins University

External person

Clarence J. Tracy

  • Arizona State University
  • School of Electrical Computer and Energy Engineering

External person

Tingyi Gu

  • Columbia University
  • Princeton University
  • Department of Electrical Engineering
  • Princeton Institute for the Science and Technology of Materials (PRISM)
  • Department of Electrical and Computer Engineering
  • University of Delaware
  • Columbia University

External person

Shan Huang

  • Georgia Institute of Technology

External person

Song Feng

  • Xi'an Polytechnic University

External person

Hans A. Bechtel

  • Lawrence Berkeley National Laboratory

External person

Ting S. Luk

  • Sandia National Laboratories NM
  • Center for Integrated Nanotechnologies

External person

Paul D. Ronney

  • University of Southern California
  • Department of Aerospace and Mechanical Engineering
  • University of Southern California

External person

Michael D. Keung

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering
  • Johns Hopkins University

External person

Darrick Williams

  • Los Alamos National Laboratory
  • Center for Integrated Nanotechnologies
  • Division of Materials Physics and Applications

External person

Ju Li

  • Xi'an Jiaotong University
  • University of Pennsylvania
  • Massachusetts Institute of Technology
  • Department of Materials Science and Engineering
  • State Key Laboratory for Mechanical Behavior of Materials
  • Department of Nuclear Science and Engineering
  • Department of Materials Science and Engineering
  • Massachusetts Institute of Technology, Department of Mechanical Engineering
  • Texas A&M University

External person

Stephen M. Goodnick

  • Arizona State University
  • School of Electrical Computer and Energy Engineering

External person

Seungyeon Lee

  • University of Minnesota

External person

Guoqing Zhang

  • Xi'an Polytechnic University

External person

S. J. Huang

  • Washington State University
  • School of Mechanical and Materials Engineering

External person

D. S. Kim

  • Seoul National University
  • Department of Physics and Astronomy
  • Center for Subwavelength Optics and Department of Physics and Astronomy
  • Department of Physics and Center for Atom Scale Electromagnetism
  • Department of Physics and Astronomy
  • Department of Physics and Astronomy
  • Department of Physics and Astronomy
  • Center for Subwavelength Optics

External person

Niels Verellen

  • KU Leuven
  • IMEC
  • Department of Physics and Astronomy

External person

Sulin Zhang

  • Pennsylvania State University Hershey
  • Northwestern University
  • Pennsylvania State University
  • University of Arkansas
  • Department of Engineering Science and Mechanics
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Mechanical Engineering Department
  • Northwestern University
  • Department of Electrical Engineering, The Pennsylvania State University

External person

L. N. Sanford

  • Washington State University
  • School of Mechanical and Materials Engineering

External person

Rohan Fernandes

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering

External person

Teng Li

  • University of Maryland
  • Department of Mechanical Engineering

External person

Bryan R. Benson

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering
  • Johns Hopkins University

External person

Jake T. Gray

  • Washington State University
  • Washington State University

External person

Chao Liu

  • University of Minnesota

External person

Lianbi Li

  • Xi'an Polytechnic University
  • University of Minnesota

External person

Jaehyun Park

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering

External person

Akihiro Kushima

  • University of Pennsylvania
  • Department of Materials Science and Engineering

External person

Mustapha Jamal

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering
  • Johns Hopkins University

External person

Jatinder S. Randhawa

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering

External person

G. Q. Zhang

  • Xi'an Polytechnic University

External person

Anum Azam

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering

External person

K. E. McNeil

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Washington State University

External person

Kai He

  • University of Maryland
  • Department of Material Science and Engineering

External person

Nishant Chandra

  • Arizona State University
  • School of Electrical Computer and Energy Engineering

External person

Jeeyoon Jeong

  • Seoul National University
  • Department of Physics and Astronomy
  • Department of Physics and Center for Atom Scale Electromagnetism

External person

Jung Il Yang

  • Korea Institute of Energy Research

External person

Aaron Bartnik

  • University of Minnesota

External person

Rong Wang

  • Xi'an Polytechnic University

External person

Victor V. Moshchalkov

  • KU Leuven
  • Department of Physics and Astronomy

External person

Su Ha

  • Washington State University
  • Washington State University

External person

Timothy G. Leong

  • Defense Threat Reduction Agency
  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering
  • Defense Threat Reduction Agency
  • Johns Hopkins University

External person

Elizabeth W. Cha

  • Johns Hopkins University
  • CIS
  • Department of Biomedical Engineering
  • Johns Hopkins University

External person

Julio A. Martinez

  • Sandia National Laboratories NM

External person

Avishek Mishra

  • University of Minnesota

External person

Liesbet Lagae

  • KU Leuven
  • IMEC
  • Department of Physics and Astronomy

External person

T. Wiser

  • Washington State University
  • School of Mechanical and Materials Engineering

External person

Yingying Zhang

  • Los Alamos National Laboratory
  • Tsinghua University
  • Center for Nano and Micro Mechanics
  • Division of Materials Physics and Applications
  • Center for Integrated Nanotechnologies

External person

J. Lee

  • Washington State University
  • School of Mechanical and Materials Engineering

External person

Wen Tao Liang

  • Pennsylvania State University Hershey
  • Pennsylvania State University
  • Department of Engineering Science and Mechanics
  • Department of Electrical Engineering, The Pennsylvania State University

External person

Omar Al-Hattamleh

  • Washington State University
  • School of Mechanical and Materials Engineering

External person

Pawan Tyagi

  • Johns Hopkins University
  • Department of Chemical and Biomolecular Engineering
  • Johns Hopkins University

External person

Yeonwoong Jung

  • Yale University
  • Department of Electrical Engineering and Applied Physics

External person

Sehyun Hwang

  • University of Minnesota

External person

Dibakar Datta

  • Brown University
  • School of Engineering

External person

B. S. Swartzentruber

  • Sandia National Laboratories NM
  • Center for Integrated Nanotechnologies

External person

J. C. Raupp

  • Washington State University
  • School of Mechanical and Materials Engineering
  • Washington State University

External person

Nicholas Buchele

  • University of Minnesota

External person

Raghuraj Hathwar

  • Arizona State University
  • School of Electrical Computer and Energy Engineering

External person