Everett A Wenzel

20162023

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  • 2016

    Electronics cooling with onboard conformal encapsulation

    Young, S. J., Janssen, D., Wenzel, E. A., Shadakofsky, B. M. & Kulacki, F. A., Jul 20 2016, Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Institute of Electrical and Electronics Engineers Inc., p. 245-253 9 p. 7517557. (Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Scopus citations