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Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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The Fingerprint is created by mining the titles and abstracts of the person's research outputs and projects/funding awards to create an index of weighted terms from discipline-specific thesauri.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Soft wearable systems to prevent and rehabilitate musculoskeletal injuries
Dunne, L. E., Holschuh, B., Johnson, J. L. & Tompkins, M.
7/8/21 → 11/1/23
Project: Research project
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Mapping Body/Garment Surface Strain Relationships for Functional Apparel Design
9/1/20 → 1/31/23
Project: Research project
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Improving Health and Well-Being with personalized, Pervasive Technology
Dunne, L. E., Gaugler, J. E., Gini, M. L., Holschuh, B., Kotlyar, M., Koutstaal, W., Michalowski, M. & Pakhomov, S. V.
1/1/19 → 1/31/21
Project: Grand Challenges
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3D Conformal Sensing of Normal Forces for On-Body Applications
10/1/18 → 1/10/20
Project: Research project
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CHARACTERIZING THE EFFECTS OF ANNEALING TEMPERATURE ON KNITTED SHAPE MEMORY ACTUATORS
Pettys Baker, R. M., Subash, N., Mack, I., Shah, S., Abel, J. & Holschuh, B., 2022, Proceedings of ASME 2022 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, SMASIS 2022. American Society of Mechanical Engineers, V001T08A004. (Proceedings of ASME 2022 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, SMASIS 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Design and Development of Novel Haptic Skin Strain Device for the Arm
Pettys Baker, R. M. & Holschuh, B., Sep 11 2022, UbiComp/ISWC 2022 Adjunct - Proceedings of the 2022 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2022 ACM International Symposium on Wearable Computers. Association for Computing Machinery, Inc, p. 99-101 3 p. (UbiComp/ISWC 2022 Adjunct - Proceedings of the 2022 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2022 ACM International Symposium on Wearable Computers).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Open Access -
Dynamic, Tunable, and Conformal Wearable Compression Using Active Textiles
Granberry, R., Clarke, M., Pettys-Baker, R., Woelfle, H., Compton, C., Ross, A., Johnson, K., Padula, S., Shah, S., Abel, J. & Holschuh, B., Dec 2022, In: Advanced Materials Technologies. 7, 12, 2200467.Research output: Contribution to journal › Article › peer-review
Open Access2 Scopus citations -
Measuring Physiological Markers of Stress During Conversational Agent Interactions
Datar, S., Ferland, L., Foo, E., Kotlyar, M., Holschuh, B., Gini, M., Michalowski, M. & Pakhomov, S., 2022, AI for Disease Surveillance and Pandemic Intelligence - Intelligent Disease Detection in Action. Shaban-Nejad, A., Michalowski, M. & Bianco, S. (eds.). Springer Science and Business Media Deutschland GmbH, p. 247-265 19 p. (Studies in Computational Intelligence; vol. 1013).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Towards the Design of a Wearable Multi-modal Haptic Device to Study Interaction Effects in Haptic Perception
Subash, N. & Holschuh, B., Sep 11 2022, UbiComp/ISWC 2022 Adjunct - Proceedings of the 2022 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2022 ACM International Symposium on Wearable Computers. Association for Computing Machinery, Inc, p. 121-122 2 p. (UbiComp/ISWC 2022 Adjunct - Proceedings of the 2022 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2022 ACM International Symposium on Wearable Computers).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Open Access